Thin film LED chip with vertical structure, micro LED array and preparation method of thin film LED chip

Abstract

The invention provides a thin-film LED chip with a vertical structure, and the chip comprises an epitaxial light-emitting structure which is provided with a first main surface and a second main surface which are opposite, and comprises an N-type epitaxial layer, a light-emitting layer and a P-type epitaxial layer which are stacked in sequence, and the epitaxial light-emitting structure is provided with a first step structure penetrating to the surface of the N-type epitaxial layer; the N electrode is arranged on the first step structure of the N-type epitaxial layer, the N electrode comprises a main body part and an extension part, the N electrode is in electrical contact with the upper surface of the first step structure through the main body part, and the extension part is formed around the side wall of the N-type epitaxial layer; and the P electrode is arranged on the first main surface of the epitaxial light-emitting structure. The invention further provides a micro LED array. According to the thin film LED chip, the problem that the current expansion uniformity of the peripheral edge in the existing chip structure is poor can be solved, and the current expansion uniformity and the effective reflection area of the chip are improved, so that the luminous efficiency of the chip is improved to the greatest extent.

Description

technical field [0001] The invention belongs to the field of semiconductor devices and manufacture, and in particular relates to a thin-film LED chip with a vertical structure. Background technique [0002] Light-emitting diodes (LEDs) have the advantages of small size, high efficiency and long life, and are widely used in traffic indication, outdoor full-color display and other fields. In particular, the use of high-power light-emitting diodes may realize semiconductor solid-state lighting, which has caused a revolution in the history of human lighting, and has gradually become a research hotspot in the field of electronics. [0003] Existing LED chips can be classified according to the positions of the electrodes: a flip-chip structure, a vertical chip structure and a front-mount chip structure. Among them, in the vertical LED chip structure, two electrodes are located at the upper and lower ends of the epitaxial layer. In this chip structure, the current distribution is ...

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a thin-film LED chip with a vertical structure, which is used to solve the problem that the current spreading effect in the local area of ​​the thin-film chip is still relatively poor, especially around the edges of the LED chip. Uneven edge current around the position, chip leakage, complex manufacturing process, yield and reliability need to be improved, etc.

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