Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat conduction material as well as preparation method and application thereof

A technology of thermally conductive materials and raw materials, applied in the direction of non-polymer adhesive additives, adhesive types, adhesives, etc., can solve the problem of poor thermal conductivity, inability to meet high thermal conductivity potting adhesives, and potting of electronic components. Glue and other issues

Active Publication Date: 2022-05-10
湖南创瑾技术研究院有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, metal and carbon-based materials do not have insulation; metal oxides and ceramics have poor thermal conductivity, including metal oxides and ceramic potting compounds. The thermal conductivity is usually around 1Wm / K, which is far from meeting high thermal conductivity potting compounds. requirements
[0005] In summary, the existing thermally conductive fillers are difficult to meet the requirements of high thermal conductivity and high insulation at the same time, and cannot be used to prepare potting adhesives suitable for electronic components

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat conduction material as well as preparation method and application thereof
  • Heat conduction material as well as preparation method and application thereof
  • Heat conduction material as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079] In this embodiment, a thermally conductive material is prepared, and the specific process is as follows:

[0080] S1. Mix 20g of modified carbon nanotubes and 25g of silicon powder in a ball mill jar; the ball mill jar contains grinding beads of zirconia, wherein the grinding beads with a diameter of 0.8mm are 90g and the grinding beads with a diameter of 4mm are 360g;

[0081] S2. add 0.42g ethylene glycol to the mixture obtained in step S1;

[0082] S3. after the mixture obtained in step S2 is ball-milled for 5h at a rotating speed of 800rpm, the grinding beads are screened out;

[0083] S4. Heat treatment of the mixture obtained in step S3 at 300° C. for 3.5 h.

[0084] The preparation process of this embodiment is all carried out under the protection of nitrogen.

Embodiment 2

[0086] A thermally conductive material is prepared in this example, and the difference between the specific process and Example 1 is:

[0087] Without performing step S4, the mixture obtained in step S3 was directly vacuum-dried at 60°C.

Embodiment 3

[0089] A thermally conductive material is prepared in this example, and the difference between the specific process and Example 1 is:

[0090] Only steps S1 and S3 are carried out, that is, no grinding aid ethylene glycol is added, and no calcination treatment of step S4 is carried out.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
diameteraaaaaaaaaa
lengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a heat conduction material and a preparation method and application thereof. The heat conduction material comprises modified carbon nanotubes and silicon particles dispersed on the surfaces of the modified carbon nanotubes, the particle size of the silicon particles is 1-5nm; and the mass of the silicon particles accounts for 50-60% of the mass of the heat conduction material. According to the heat conduction material, the conductive modified carbon nanotubes are wrapped with the insulating silicon particles, insulation of the modified carbon nanotubes is achieved, and therefore the high heat conduction material with the insulating property can be obtained. The invention also provides a preparation method and application of the heat conduction material.

Description

technical field [0001] The invention belongs to the technical field of insulation potting and in particular relates to a thermally conductive material and a preparation method and application thereof. Background technique [0002] Potting compounds are mainly used for bonding, sealing and protecting industrial components. At present, potting glue has been widely used in the electronic device manufacturing industry. It is an indispensable insulating material in the electronic industry. It can strengthen the integrity of electronic devices, improve the resistance to external shocks and vibrations, and can be used for internal components and circuits. Provide insulation between. [0003] With the development of microelectronics and integrated circuits in the direction of high speed, high density, miniaturization and light weight, the volume of electronic components and logic circuits is compressed, and the heat generated by unit volume of electronic equipment increases sharply...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J11/04C09J163/02
CPCC09J11/04C09J163/00C08K3/041C08K9/10C08K2201/005C08K2201/006C08K2201/011
Inventor 俞国金周佩先赖金洪
Owner 湖南创瑾技术研究院有限公司