Support unit and apparatus for processing substrate

A technology for supporting units and supporting substrates, applied to electrical components, ohmic resistance heating devices, circuits, etc., can solve problems such as temperature rise of the driving device, failure to drive the driving device normally, failure of the driving device, etc., and achieve the minimum excessive rise effect

Pending Publication Date: 2022-05-20
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the heat radiated from the lamp is transferred to the driving device of the spin head that rotates the substrate, the temperature of the driving device rises
When the temperature of the drive unit rises, it will not be able to drive the drive unit normally or cause the drive unit to malfunction

Method used

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  • Support unit and apparatus for processing substrate
  • Support unit and apparatus for processing substrate
  • Support unit and apparatus for processing substrate

Examples

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Embodiment Construction

[0045] Hereinafter, exemplary embodiments of the present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. However, the present invention can be variously implemented and is not limited to the following examples. In the following description of the present invention, detailed descriptions of known functions and constructions incorporated herein are omitted to avoid making the subject matter of the present invention unclear. Also, for components having similar functions and roles, the same reference numerals are used throughout the drawings.

[0046] Unless expressly stated to the contrary, the term "comprise" and variations such as "comprises" or "comprising" are understood to imply the inclusion of stated elements but not the exclusion of any other elements. It should be understood that the terms "comprising" and "having" are intended to specify the presence of fe...

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PUM

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Abstract

There is provided a support unit for supporting a substrate, the support unit including: a heating member configured to transfer thermal energy to the substrate being supported; a reflecting plate disposed below the heating member and configured to reflect heat energy generated by the heating member to the substrate; a cooling plate disposed below the reflecting plate and formed with a cooling flow path in which a cooling fluid flows; and a gas supply line configured to supply gas to a space between the reflecting plate and the cooling plate.

Description

technical field [0001] The present invention relates to a support unit and substrate processing equipment. Background technique [0002] In general, various processes such as a photoresist coating process, a developing process, an etching process, and an ashing process are performed in the process of processing a glass substrate or wafer or in the process of manufacturing a flat panel display device or a semiconductor. Among the various processes, in order to remove various contaminants attached to the substrate, a wet cleaning process using a chemical solution or deionized water and a drying process for drying the chemical solution or deionized water remaining on the substrate surface are performed . [0003] Recently, a treatment process (for example, an etching process) for selectively removing a silicon nitride film and a silicon oxide film by using a chemical solution such as sulfuric acid or phosphoric acid has been performed. Among substrate processing apparatuses u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67051H01L21/67253H01L21/67103H01L21/68721H01L21/67115H01L21/67109H01L21/68728H01L21/6875H01L21/6708H01L21/68764H01L21/68785H05B3/0047H01L21/67023
Inventor 宋修汉金喆求崔重奉申哲榕金载烈
Owner SEMES CO LTD
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