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Low-cost thick-film conductor paste

A conductive paste, low-cost technology, used in conductive materials dispersed in non-conductive inorganic materials, transportation and packaging, coatings, etc., can solve the problems of poor solder resistance, high product cost, etc. Small, good aging tension and simple preparation process

Inactive Publication Date: 2022-05-24
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to solve the technical problems of existing conductor pastes for thick film circuits, low-cost products with poor solder resistance, high cost of products with good solder resistance, and limited product applications, and provide a low-cost and good Thick-film conductor paste with soldering resistance, used in thick-film circuit products, to meet the low-cost use requirements of conductor paste

Method used

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Embodiment Construction

[0017] The present invention will be described in detail below with reference to specific embodiments, which do not limit the protection scope of the present invention. The protection scope of the present invention is only limited by the claims, and any omissions, substitutions or modifications made by those skilled in the art on the basis of the disclosed embodiments of the present invention will fall into the protection scope of the present invention.

[0018] 1. Preparation of silver-coated copper-nickel alloy powder

[0019] Dissolve silver nitrate in pure water to form Ag 2+ Solution A with ion concentration of 5g / L; dissolve ascorbic acid in pure water to form solution B with pH of 6 and ascorbic acid concentration of 10g / L; add spherical copper-nickel alloy powder with particle size of 0.3-0.5μm into pure water , to form a suspension C with a copper-nickel alloy powder concentration of 10 g / L; under stirring conditions, add solution A and solution B dropwise to suspens...

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Abstract

The invention discloses low-cost thick-film conductor paste which is prepared by mixing silver powder, silver-coated copper-nickel alloy powder, glass powder, inorganic oxide and an organic carrier to prepare paste paste with certain fluidity. The silver-coated copper-nickel alloy powder is adopted to replace palladium and platinum noble metal powder in the thick-film conductor paste, so that the cost of the thick-film conductor paste is effectively reduced while the welding resistance of the thick-film conductor paste is ensured. The thick-film conductor paste has the advantages of stable and reliable welding resistance, high aging tension and low cost.

Description

technical field [0001] The invention belongs to the technical field of conductor paste for thick-film circuits, in particular to a conductor paste for thick-film circuits that does not contain palladium and platinum, has low cost and good solder resistance, is widely used in alumina ceramic substrates, and adopts thick-film conductor pastes. In the thick film circuit products of the printing process. Background technique [0002] Electronic paste is the basic material for the manufacture of thick film components. It is a paste that is uniformly mixed with solid powder and organic solvent through three-roll rolling. It is widely used in thick film products in the modern microelectronics industry. With the wide application of thick-film circuit products in the modern microelectronics industry, as the prices of palladium and platinum precious metal materials continue to rise, the requirements for low-cost conductor pastes for thick-film circuits are getting higher and higher. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/16B22F9/24B22F1/17
CPCH01B1/22H01B1/16B22F9/24Y02E10/50
Inventor 不公告发明人
Owner 西安宏星电子浆料科技股份有限公司
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