Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor packaging structure convenient to assemble and disassemble

A packaging structure and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, transportation and packaging, electrical components, etc., can solve problems such as chip inspection and maintenance obstruction, increase the limitations of the adhesive layer packaging structure, and reduce the heat dissipation performance of the packaging structure. , to achieve high-quality heat dissipation effect, save the operation process of coating and curing, and improve the effect of protection and comprehensive performance

Active Publication Date: 2022-05-24
中山市卓满微电子有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]When the current semiconductor chip is packaged, it is difficult to accurately embed the chip in the center of the packaging structure for stabilization, resulting in loosening of the chip after the structure is packaged, and the packaging structure often It is formed by sealing the upper cover plate and the lower base, and is sealed with an adhesive layer. However, although the adhesive layer ensures the sealing effect of the packaging structure, it is difficult to disassemble it again, which hinders the inspection and maintenance of the chip, and increases the adhesive layer packaging structure. In addition, after the packaging structure is combined with the whole through the adhesive layer, more heat is easily accumulated in the cavity of the structure. If the heat is accumulated in the cavity for a long time, it will deform the surface of the chip and reduce the heat dissipation performance of the packaging structure. reduce the lifetime of the chip

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor packaging structure convenient to assemble and disassemble
  • Semiconductor packaging structure convenient to assemble and disassemble
  • Semiconductor packaging structure convenient to assemble and disassemble

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Example 1, as Figure 1-6 As shown in the figure, a packaging method for a semiconductor packaging structure that is easy to assemble and disassemble, the method steps are as follows:

[0037] Step 1: the semiconductor chip 10 is transported on the surface of the second conveyor line 6, the package base 8 is transported on the surface of the transport bus 2, and the package cover plate 9 is transported on the surface of the first conveyor line 4;

[0038] Step 2: After the package base 8 is transported to the first designated position on the surface of the conveying bus 2, it can be activated by the structure of the grasping displacement mechanism 7 above the gantry 5, grasping the transporting and positioning semiconductor chips 10, and The semiconductor chip 10 is embedded in the inner side of the package groove 82 for positioning, and at this time, the package base 8 and the embedded semiconductor chip 10 can be continuously transported through the conveying bus 2; ...

Embodiment 2

[0041] Example 2, as Figure 3-6 As shown in the figure, the positioning board can be fixed at the four corners where the chip needs to be installed, and the chip embedded in the package groove 82 can drive the board to snap into the four groups of notches opened on the edge of the package groove 82, so that the chip can be perfectly aligned with the silicone layer. 84 are attached to each other to improve the stability of chip assembly, and the splicing of the U-shaped frame 91 and the U-shaped seat 81 can drive the bottom surface of the heat dissipation screen frame 93 to be inserted into the insert board and the surface of the notch, and the embedded chip can be further processed. The sticking is firm to ensure the fixing effect of the chip. When the U-shaped frame 91 and the U-shaped seat 81 need to be disassembled and separated, the two sets of buckles 95 can be pressed at the same time to cancel the fixing with the card slot 87. The U-shaped frame 91 is lifted upward, so...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a semiconductor packaging structure convenient to assemble and disassemble, which comprises a machine table, a conveying bus, a first conveying line and a second conveying line are respectively arranged on the end face of the machine table, portal frames fixedly connected with the machine table are arranged on the two sides of one end of the conveying bus, and grabbing displacement mechanisms are arranged on the inner sides of the two portal frames. One set of grabbing displacement mechanism is located on one side of the second conveying line and the conveying bus, the other set of grabbing displacement mechanism is located on one side of the first conveying line and the conveying bus, and a control table is arranged on one side of the bottom of one end of the machine table. According to the invention, through the structural cooperation of the packaging base and the packaging cover plate, the chip embedded inside can be packaged and protected when the two groups of plate bodies of the U-shaped structure are folded, and the folding operation of the two groups of U-shaped plates is promoted to obtain auxiliary guiding and limiting functions through the structural cooperation of the positioning convex blocks and the positioning grooves; and meanwhile, the sealing performance of semiconductor chip packaging is enhanced.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, in particular to a semiconductor package structure that is convenient for loading and unloading. Background technique [0002] The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and post-package testing. After plastic packaging, a series of operations are also performed, such as post-curing, rib cutting and molding, electroplating, and printing processes. Typical packaging process flow For: dicing, chip loading, bonding, plastic sealing, de-flashing, electroplating, printing, rib cutting and molding, visual inspection, finished product testing and packaging and shipping, and when plastic sealing, it is often packaged through adhesive layer curing to match the structure. [0003] When the current semiconductor chip is packaged, it is difficult to accurately embed the chip into the center of the package structure, which leads to the lo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/68H01L21/67
CPCH01L21/67763H01L21/68H01L21/67098H01L21/67103
Inventor 顾桂嶂白海燕张作易
Owner 中山市卓满微电子有限公司