Organic/inorganic hybrid polymer capable of reducing water vapor transmittance

A technology of water vapor transmission rate and inorganic oxides, which is applied in semiconductor/solid-state device manufacturing, coating, electric solid-state devices, etc., can solve low water vapor transmission rate, weak water vapor barrier performance, inability to fill pinholes and cracks and other problems, to achieve the effect of easy operation of equipment and simple equipment

Pending Publication Date: 2022-05-27
浙江弘康半导体技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are often pinholes and cracks in the single-layer barrier films prepared by these methods, and a lower water vapor transmission rate (WVTR) cannot be obtained.
The traditional organic transition layer mainly plays the role of adhesion, which can neither fill the pinholes and cracks in the inorganic layer, nor bond with the oxide layer to form a synergistic effect, so it has little effect on improving the water vapor barrier performance

Method used

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  • Organic/inorganic hybrid polymer capable of reducing water vapor transmittance
  • Organic/inorganic hybrid polymer capable of reducing water vapor transmittance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The synthetic method is as follows:

[0028] Step 1. Mix the organosiloxane resin with the coupling agent KH-560 in a ratio of 95:5 by mass, and heat in a water bath.

[0029] Step 2. Stir for 20 min under heating in a water bath at 100°C, and seal in the meantime.

[0030] Step 3. After the stirring is stopped, let it stand while the heating temperature of the water bath is 100°C and the time is 20min.

[0031] Step 4. The WVTR with UV light is 1.2958g m -2 ·day -1 The left and right silicon oxide barrier films were treated for 10 min.

[0032] Step 5. Spin coating a layer of 1um organic / inorganic hybrid polymer on the surface of the silicon oxide barrier film by spin coating.

[0033] Step 6. Curing at 60°C for 24 hours.

[0034] The water vapor barrier properties and light transmittance properties of the samples were tested by using the C390H water vapor transmission instrument of Languang Company and the UV-Vis-Near Infrared Spectrophotometer (UV-3600) of Shima...

Embodiment 2

[0036] The synthetic method is as follows:

[0037] Step 1. Mix the organosiloxane resin with the coupling agent KH-560 in a ratio of 90:10 by mass, and heat in a water bath.

[0038] Step 2. Stir for 20 min under heating in a water bath at 100°C, and seal in the meantime.

[0039] Step 3. After the stirring is stopped, let it stand while the heating temperature of the water bath is 100°C and the time is 20min.

[0040] Step 4. The WVTR with UV light is 1.3651g m -2 ·day -1 The left and right silicon oxide barrier films were treated for 10 min.

[0041] Step 5. Spin coating a layer of 1um organic / inorganic hybrid polymer on the surface of the silicon oxide barrier film by spin coating.

[0042] Step 6. Curing at 60°C for 24 hours.

[0043] The water vapor barrier properties and light transmittance properties of the samples were tested by using the C390H water vapor transmission instrument of Languang Company and the UV-Vis-Near Infrared Spectrophotometer (UV-3600) of Shim...

Embodiment 3

[0045] The synthetic method is as follows:

[0046] Step 1. Mix the organosiloxane resin with the coupling agent KH-560 in a ratio of 85:15 by mass, and heat in a water bath.

[0047] Step 2. Stir for 20 min under heating in a water bath at 100°C, and seal in the meantime.

[0048] Step 3. After the stirring is stopped, let it stand while the heating temperature of the water bath is 100°C and the time is 20min.

[0049] Step 4. The WVTR is 1.3364g m with UV light -2 ·day -1 The left and right silicon oxide barrier films were treated for 10 min.

[0050] Step 5. Spin coating a layer of 1um organic / inorganic hybrid polymer on the surface of the silicon oxide barrier film by spin coating.

[0051] Step 6. Curing at 60°C for 24 hours.

[0052] The water vapor barrier properties and light transmittance properties of the samples were tested by using the C390H water vapor transmission instrument of Languang Company and the UV-Vis-Near Infrared Spectrophotometer (UV-3600) of Shim...

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Abstract

The invention discloses an organic / inorganic hybrid polymer capable of reducing water vapor transmission rate. The organic / inorganic hybrid polymer is coated on an aluminum oxide and silicon oxide water vapor barrier layer and is cured. The preparation method comprises the following steps: mixing organosiloxane monomers according to a certain ratio, and carrying out hydrolytic condensation reaction under a certain condition. When the organic / inorganic hybrid polymer is coated on an aluminum oxide and silicon oxide barrier layer and cured, on one hand, pinholes and cracks in an inorganic layer can be filled; on the other hand, closer chemical bonds are generated through reaction with active hydroxyl groups on the surface of the inorganic layer, so that a synergistic effect is generated, and finally, the water vapor transmission rate (WVTR) is reduced by one order of magnitude.

Description

technical field [0001] The invention relates to the technical field of flexible films, in particular to an organic / inorganic hybrid polymer with reduced water vapor transmission rate. Background technique [0002] Today, barrier films that isolate water vapor are widely used in thin-film encapsulation of food and pharmaceuticals and flexible electronic devices (eg, electronic skin, organic thin-film solar cells, organic light-emitting diodes, etc.). Industrially produced barrier films usually deposit oxide films on substrates by means of enhanced chemical vapor deposition, electron beam evaporation, and magnetron sputtering. However, there are often pinholes and cracks in the single-layer barrier films prepared by these methods, and a lower water vapor transmission rate (WVTR) cannot be obtained. The traditional organic transition layer mainly plays the role of adhesion, which can neither fill the pinholes and cracks in the inorganic layer nor bond with the oxide layer to f...

Claims

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Application Information

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IPC IPC(8): C09D183/04C09D1/00H01L51/44H01L51/52
CPCC09D183/04C09D1/00H10K30/88H10K50/844Y02E10/549
Inventor 徐从康王坤王江涌冯煜锋
Owner 浙江弘康半导体技术股份有限公司
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