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Circuit board manufacturing method for improving signal transmission precision

A manufacturing method and signal transmission technology, applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of high cost, complex manufacturing process, low speed and precision, etc. The effect of improving work efficiency

Pending Publication Date: 2022-05-27
GUANGDONG CHAMPION ASIA ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention proposes a circuit board manufacturing method for improving signal transmission accuracy, which solves the problems of complicated manufacturing process, high cost, and low speed and precision existing in the existing circuit board manufacturing method

Method used

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  • Circuit board manufacturing method for improving signal transmission precision
  • Circuit board manufacturing method for improving signal transmission precision

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] refer to figure 1 As shown, a method for manufacturing a multilayer circuit board for improving signal transmission accuracy, the method for manufacturing a multilayer circuit board includes the following steps:

[0030] S1. Slicing: Provide the substrate to be processed according to the production specifications, and the provided substrate has a metal layer on the front and back, and then open the substrate according to the production specifications;

[0031] S2. Lamination: Clean and dry the substrate after cutting. According to the number of layers of the circuit, stack the single-layer substrate according to the stacking sequence, and press the laminated multi-layer substrate. to obtain a multi-layer substrate;

[0032] S3. Pretreatment: the multi-layer substrate is opened, and the inside of the hole is copper-plated, and then the circuit pattern is transferred to the substrate, and it is exposed to plate making and development;

[0033] S4. Etching: Etch the subs...

Embodiment 2

[0036] A method for manufacturing a multilayer circuit board for improving signal transmission accuracy, the method for manufacturing the multilayer circuit board comprises the following steps:

[0037] S1. Slicing: Provide the substrate to be processed according to the production specifications, and the provided substrate has a metal layer on the front and back. The metal layer is a copper layer with a thickness of 30-50 microns, and a conductive film is arranged between the metal layer and the substrate. , and then cut the substrate according to the production specifications;

[0038] S2. Lamination: Clean and dry the substrate after cutting. According to the requirements of the number of layers of the circuit, stacking is performed on the single-layer substrate according to the stacking sequence, and PP is arranged between the stacked single-layer substrates. Sheet, the substrate and the PP sheet are stacked in order to form a pre-fixed circuit, the laminated multilayer sub...

Embodiment 3

[0043] refer to figure 2 As shown, a method for manufacturing a single-layer circuit board for improving signal transmission accuracy, the method for manufacturing a single-layer circuit board includes the following steps:

[0044] S1. Slicing: Provide the substrate to be processed according to the production specifications, and the provided substrate has a metal layer on the front and back, and then open the substrate according to the production specifications;

[0045] S2, pretreatment: the multi-layer substrate is opened, and the inside of the hole is copper-plated, and then the circuit pattern is transferred to the substrate, and it is exposed to plate making and development;

[0046] S3. Etching: The substrate is etched based on the circuit pattern to form a circuit, and the circuit is flattened;

[0047] S4. Installation: Based on the substrate, the components are welded and installed, and the installation is tested.

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Abstract

The invention discloses a circuit board manufacturing method for improving signal transmission precision, relates to the technical field of circuit board manufacturing, and provides the following scheme aiming at the problems of complex manufacturing process, high cost and low speed and precision of the existing circuit board manufacturing method. The manufacturing method of the circuit board comprises the following steps: S1, cutting: providing a substrate with metal layers on the front surface and the back surface, and cutting the substrate; s2, lamination: carrying out stack-up lamination on the single-layer substrate according to a stack-up sequence, and carrying out lamination; s3, pretreatment: carrying out trepanning and copper plating treatment on the multi-layer substrate, and carrying out circuit pattern transfer, exposure plate making and development on the substrate; s4, etching: etching based on the circuit pattern; and S5, mounting: welding and mounting components based on the substrate. The circuit board manufacturing method for improving the signal transmission precision is easy to operate, suitable for manufacturing circuit boards of different specifications, high in conductivity and capable of effectively improving the signal transmission precision of the circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board manufacturing method for improving signal transmission accuracy. Background technique [0002] With the advancement of electronic information industry technology and the development of the integrated circuit industry, the application of circuit boards is becoming more and more extensive, and the requirements for circuit boards are also getting higher and higher. Based on the development of equipment to high efficiency and high precision, the existing The circuit board forms a conductive pattern on the insulating substrate through the methods of screen printing, electroplating and pasting, and corrodes the exposed copper, and then removes the remaining photoresist to obtain the desired circuit pattern. Circuit board, and the conductive circuit formed by electroless copper plating is used to weld electronic devices, but this method will use a lar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/02H05K3/42H05K3/46
CPCH05K3/0047H05K3/423H05K3/027H05K3/4611
Inventor 刘继承李强邹乾坤
Owner GUANGDONG CHAMPION ASIA ELECTRONICS CO LTD
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