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Broadband high-power amplifier based on temperature compensation

A high-power amplifier, temperature compensation technology, used in power amplifiers, amplifier combinations, improving amplifiers to expand bandwidth, etc., can solve the problems of accelerated device failure, junction temperature rise, affecting the DC characteristics of devices, etc., to improve efficiency, high The effect of high efficiency and high power output

Pending Publication Date: 2022-05-31
CHONGQING UNIV OF POSTS & TELECOMM
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When a GaN HEMT works at a large drain voltage, it will generate a certain amount of power dissipation, and this part of the dissipated power will generate corresponding heat inside the device, making the junction temperature of the device have a very obvious The rise of the junction temperature will not only affect the DC characteristics of the device, but also accelerate the failure of the device itself

Method used

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  • Broadband high-power amplifier based on temperature compensation
  • Broadband high-power amplifier based on temperature compensation
  • Broadband high-power amplifier based on temperature compensation

Examples

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Embodiment Construction

[0044] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic concept of the present invention, and the following embodiments and the features in the embodiments can be combined with each other in the case of no conflict.

[0045] Such as figure 1 As shown, the temperature compensation circuit in this embodiment is simple to build using components, and can complete the change of...

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Abstract

The invention relates to a broadband high-power amplifier structure based on temperature compensation, and belongs to the field of high-power amplifiers. The structure comprises two parts: one part is a temperature compensation part which comprises a voltage linear reduction circuit, a voltage equal-ratio amplification circuit and a resistance voltage division circuit; and the high-power amplifier part comprises a power distribution / synthesis network and two power amplifier branches. Wherein the temperature compensation part can enable the output voltage to linearly change along with the temperature, then the output voltage is stably amplified, and distribution of the output voltage is adjusted according to requirements. The power distribution / synthesis network adopts a Wilkinson structure; the two power amplifier branches adopt a multi-section lambda / 4 stepped impedance conversion network, and the filtering performance is achieved while the bandwidth is widened. The temperature compensation circuit is designed for the problem that the direct current characteristic of the high-power amplifier deteriorates under the high-temperature condition, the direct current characteristic of the high-power amplifier is improved, and therefore the efficiency, gain, power and other performance of the high-power amplifier are optimized.

Description

technical field [0001] The invention belongs to the field of high-power amplifiers and relates to a wide-band high-power amplifier based on temperature compensation. Background technique [0002] Today, high power amplifiers have important applications in wireless communications and test instrumentation. For example, when performing long-distance high-data transmission, the power amplifier used in the wireless communication system needs to have higher linear output power to support data transmission; similarly, the most typical test in the field of test equipment is automotive EMC testing Power amplifier, the biggest feature of the power amplifier used in the test is high power, which is used to meet the needs of the test system. [0003] AlGaN / GaN materials are the most widely used materials for high power amplifiers. When a GaN HEMT works at a large drain voltage, it will generate a certain amount of power dissipation, and this part of the dissipated power will generate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03F1/30H03F1/42H03F1/56H03F1/26H03F1/02H03F3/20H03F3/68
CPCH03F1/30H03F1/42H03F1/56H03F1/26H03F1/02H03F3/20H03F3/68
Inventor 王斌黄梓原李铮邓燕
Owner CHONGQING UNIV OF POSTS & TELECOMM
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