Ball grid array millimeter wave broadband matching structure and design method in wafer level packaging
A technology of wafer-level packaging and ball grid array, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems such as signal line mismatch, achieve impedance matching, reduce return loss, Reduce the effect of the discontinuity
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[0055] like figure 1 and figure 2 As shown, a ball grid array millimeter-wave broadband matching structure in wafer-level packaging includes a silicon-based chip 1, a microwave dielectric substrate 91, and metal ground plates 81 on both sides of the upper surface of the microwave dielectric substrate 91, located on the microwave dielectric substrate 91. The lower metal grounding plate 82 on the lower surface is used to connect the metal grounding plates 81 on both sides with the metal vias 71 of the lower metal grounding plate 82 , the circular metal plate 21 and the semicircular slot 22 on the upper surface of the microwave dielectric substrate 91 .
[0056] like figure 2 As shown, the upper surface of the microwave dielectric substrate 91 is sequentially connected along the positive direction of the x-axis to the first branch 11 signal line, the second branch 12 signal line, the third branch 13 signal line, the fourth branch 14 signal line, and the fifth branch. 15 signa...
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