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Interdigital resonator and preparation method thereof

A resonator and interdigital technology, applied in the field of interdigitated resonators and their preparation, can solve problems such as inapplicability of interdigitated resonators, and achieve the effects of reducing lateral leakage and improving quality factor

Pending Publication Date: 2022-05-31
武汉敏声新技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the prior art, measures such as air bridges and boundary rings are usually used to improve the device quality factor and reduce energy loss, but the boundary ring and air bridge structures are only suitable for thin film bulk acoustic resonators with flat electrodes and not for interdigital resonators. device

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  • Interdigital resonator and preparation method thereof
  • Interdigital resonator and preparation method thereof

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Embodiment Construction

[0030] The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments, and illustrate the best mode for practicing the embodiments. After reading the following description with reference to the accompanying drawings, those skilled in the art will understand the concepts of the invention and will recognize applications of these concepts not specifically set forth herein. It should be understood that these concepts and applications are within the scope of the invention and the appended claims.

[0031] It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present inv...

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Abstract

The invention discloses an interdigital resonator and a preparation method thereof, and relates to the technical field of semiconductors, the interdigital resonator comprises a substrate layer, a piezoelectric layer and a metal electrode layer which are stacked in sequence, the metal electrode layer is divided into an interdigital area and electric connection areas connected to the two ends of the interdigital area respectively, and the piezoelectric layer is arranged on the substrate layer. The two electric connection areas are distributed in the extending direction of the interdigitals, and at least two rows of blocking bodies are arranged on the surfaces of the electric connection areas in the extending direction of the interdigitals at intervals and used for limiting sound wave transmission. According to the interdigital resonator provided by the invention, the photonic crystal structure is arranged around the effective resonance area of the device, so that the transverse leakage of sound wave energy is effectively reduced, and the quality factor of the device is improved. Meanwhile, the phononic crystal structure is arranged above the electric connection area, so that the conductivity and the mechanical stability of the electric connection area are not influenced.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and in particular, to an interdigital resonator and a preparation method thereof. Background technique [0002] With the rapid development of wireless communication, wireless signals are becoming more and more crowded, and new requirements such as integration, miniaturization, low power consumption, high performance and low cost are put forward for filters working in the radio frequency band. Interdigital resonators have gradually become a hot spot in RF filter research because they meet the above requirements and can realize multi-band integration on a single wafer through existing processes. [0003] Since the interdigital resonator needs to simultaneously apply signal excitation to all the interdigital resonators during operation, an electrical connection area is often designed at both ends of the interdigitated fingers during design. In addition to the thickness direction, the...

Claims

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Application Information

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IPC IPC(8): H03H9/17H03H9/13H03H9/02H03H3/02
CPCH03H9/17H03H9/02118H03H9/132H03H3/02
Inventor 罗天成温志伟谢英刘文娟孙博文孙成亮
Owner 武汉敏声新技术有限公司
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