Corrosion liquid medicine spraying device and method for improving wafer liquid medicine corrosion uniformity

A technology of liquid medicine and wafer, applied in the direction of climate sustainability, sustainable manufacturing/processing, final product manufacturing, etc. The effect of stability, good fluidity of liquid medicine, and dynamic uniform corrosion

Pending Publication Date: 2022-06-03
广州市众拓光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are many disadvantages. It is usually completed in the corrosion process tank. In order to increase the production capacity, dozens of pieces need to be processed at a time, and the chemical reaction in the corrosion process is violent, which is an exothermic reaction, accompanied by a large amount of heat release, resulting in a rapid rise in the temperature of the corrosion solution. , the corrosion rate is accelerated, the corrosion effect is affected, and even over-corrosion occurs

Method used

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  • Corrosion liquid medicine spraying device and method for improving wafer liquid medicine corrosion uniformity
  • Corrosion liquid medicine spraying device and method for improving wafer liquid medicine corrosion uniformity
  • Corrosion liquid medicine spraying device and method for improving wafer liquid medicine corrosion uniformity

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Embodiment 1

[0039] This embodiment provides a spraying device for corrosive liquid medicine, such as Figure 1-5 As shown, a machine control system 5 is included, and the machine control system 5 is respectively connected to the cassette module 4, the robot module 3, the 4 corrosion modules and the chemical supply module.

[0040] The machine control system 5 includes a central controller for controlling the cassette module 4, the robot module 3, a plurality of the corrosion modules and the chemical supply module to realize automatic control of the wafer corrosion process ;The central controller adopts win10 operating system and has a large-screen touch display screen to display the function execution of each module during the operation of the equipment, as well as display and modify process parameters, support MES interface Ethernet, MES system and equipment two-way mutual corresponding recipe management .

[0041] The cassette module 4 includes a cassette housing 10 , and a plurality o...

Embodiment 2

[0047] The present embodiment provides a method for improving the etching uniformity of the chemical solution of the wafer, using the device of the first embodiment, and using phosphoric acid to corrode the gallium nitride wafer, including the following steps:

[0048] (1) Heat the corrosion liquid in the liquid storage tank to the set temperature and set time, the temperature is 120°, and the liquid needs to be heated at 120° for 6 hours before it can be operated. After the liquid medicine is ready, the machine control system controls the robot module to sequentially take out the wafers from the metal jam and place them in the centering device for centering, and then transfer the centered wafers to the horizontal suction cups of each corrosion module one by one.

[0049] (2) There are 4 corrosion units in the device, which can work at the same time. The specific operations are: start the rotating motor to make the rotation speed of the horizontal suction cup reach 1500rpm, and...

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Abstract

The invention provides a corrosive liquid medicine spraying device and a method for improving the liquid medicine corrosion uniformity of a wafer. The device comprises a machine table control system, and the machine table control system is connected with a wafer box module, a robot module, a plurality of corrosion modules and a chemical supply module. The method for improving the wafer liquid medicine corrosion uniformity comprises the steps that corrosion liquid medicine in a liquid medicine storage tank is heated to a set temperature and set time, and wafers are conveyed to a horizontal suction cup of each corrosion module one by one through a robot module; starting a rotating motor, and starting the nozzle to carry out pre-corrosion operation; the rotating speed of the rotating motor is reduced, and the nozzle is started to carry out second corrosion operation, so that the whole wafer is paved with the liquid medicine; stopping the nozzle, keeping the rotating speed of the rotating motor at 10-50rpm, and continuing to corrode for 10-20 minutes; after corrosion is completed, a nozzle loaded with water is started for water spraying operation; repeating the previous steps for 2-3 times; and collecting the corrosion waste liquid and the water washing liquid generated in the previous process, and introducing into a liquid medicine treatment platform for treatment.

Description

technical field [0001] The invention relates to the technical field of semiconductor preparation, and in particular relates to a spraying device for chemical liquid for corrosion and a method for improving the uniformity of corrosion of chemical liquid for wafers. Background technique [0002] At present, the traditional liquid chemical process uses liquid chemicals or etchants to remove the substrate material. The advantages of the liquid chemical etching process are simple equipment, high corrosion rate and high selectivity. However, there are many disadvantages, which are usually completed in the corrosion process tank. In order to increase the production capacity, dozens of pieces need to be processed at a time, and the chemical reaction of the corrosion process is violent. It is an exothermic reaction, accompanied by a large amount of heat release, resulting in a rapid increase in the temperature of the corrosion solution. , the corrosion rate is accelerated, which affe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/306H01L21/311H01L21/3213H01L21/465
CPCH01L21/6708H01L21/30604H01L21/31111H01L21/31133H01L21/32134H01L21/465Y02P70/50
Inventor 李国强
Owner 广州市众拓光电科技有限公司
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