Double-sided liquid cooling heat dissipation multi-channel comprehensive assembly

Abstract

The invention provides a multi-channel comprehensive assembly with efficient double-sided liquid cooling heat dissipation capability, and belongs to a radar assembly heat dissipation technology. The integrated assembly adopts a sandwich type structural layout, and four-channel T / R assemblies on the two sides and a liquid cooling plate in the middle are integrated together. According to the liquid cooling plate, an S-shaped water channel is arranged in a shell, and a heat conduction turbulent flow column is arranged at the position, corresponding to a power amplifier chip, of the S-shaped water channel. The density of the heat conduction flow-around columns is gradually increased from the water inlet to the water outlet, the number of the heat conduction flow-around columns is reasonably optimized according to calculation and simulation analysis at the chip positions with different liquid path lengths from the liquid inlet, the number of the near-end flow-around columns is small, and the number of the far-end flow-around columns is large. The heat conduction turbulent flow columns can improve the local flow speed of cooling liquid through the turbulent flow effect, meanwhile, the local solid-liquid heat exchange area is increased, and the heat dissipation efficiency is improved. The heat dissipation performance of the T / R assembly can be effectively improved, the temperature difference of the power amplifier chips between different channels is controlled within a small range, and the phase consistency of the assembly is improved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of radar components, in particular to a multi-channel comprehensive component with double-sided liquid cooling and heat dissipation. Background technique [0002] With the development requirements of high power and high heat consumption of modern radar technology, liquid cooling has been used more and more in the cooling of phased array radar T / R components, and has become an important component of the antenna array of high power phased array radar. In some cases, the heat dissipation capacity of T / R components and the temperature control between different channel power amplifier chips are becoming more and more stringent. For small-volume, high-power TR components, due to the small size, cramped heat dissipation space, and high heat flow density, the current conventional deep hole drilling or simple flow channel liquid cold plate has become more and more difficult to meet the component h...

AI Technical Summary

Problems solved by technology

For small-volume, high-power TR components, due to the small size, cramped heat dissipation space, and high heat flux density, it is increasingly difficult for conventional deep-hole drilling or simple flow channel liquid cooling plates to meet the heat dissipation needs of components, and often Electrical connector failure due to coolant leakage, or failure due to equipment condensation due to coolant leakage or low supply fluid temperature

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