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Three-dimensional fan-out type packaging structure and manufacturing method thereof

A packaging structure and fan-out technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve problems such as accumulation and warping heat, so as to improve support strength, improve warpage and The effect of cooling problems

Pending Publication Date: 2022-06-21
WUXI ZHONGWEI GAOKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a three-dimensional fan-out packaging structure and a manufacturing method of the three-dimensional fan-out packaging structure, which solves the problems of warping and heat accumulation in the related art

Method used

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  • Three-dimensional fan-out type packaging structure and manufacturing method thereof
  • Three-dimensional fan-out type packaging structure and manufacturing method thereof
  • Three-dimensional fan-out type packaging structure and manufacturing method thereof

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Embodiment Construction

[0050] In the embodiment of the present invention, the material filled in the second filling layer 205 can specifically be a resin and an inorganic substance (SiO 2 or Al 2 o 3 ) to form a composite material.

[0051] It should be noted that, in the embodiment of the present invention, the material of the vertical lead 108 can be any one of Al, Cu and Au, and generally the height of the vertical lead 108 is greater than 25 μm.

[0052] In the embodiment of the present invention, the plastic sealing height of the first plastic sealing layer 109 is generally not greater than 294 μm, and the sealing thickness of the second plastic sealing layer 204 is greater than 50 μm.

[0053] As another embodiment of the present invention, a method for manufacturing a three-dimensional fan-out packaging structure is provided, which is used to manufacture the aforementioned three-dimensional fan-out packaging structure, wherein the manufacturing method includes:

[0054] It should be noted ...

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PUM

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Abstract

The invention relates to the technical field of integrated circuit packaging, and particularly discloses a three-dimensional fan-out type packaging structure, which comprises a passive carrier plate provided with a plurality of metal filling blind holes, and a first rewiring metal layer and a first rewiring passivation layer are formed on the front surface of the passive carrier plate; the first re-wiring passivation layer is connected with a first chip plastic package structure through a vertical lead bonding pad and a vertical lead, a second re-wiring metal layer and a second re-wiring passivation layer are formed on the first chip plastic package structure, and a second chip plastic package structure is formed on the second re-wiring passivation layer; and back surface grooves are formed in the back surface of the passive support plate, back surface passivation layers are arranged on the back surface of the passive support plate except the bottom wall positions of the back surface grooves, metal bumps are formed in one part of the back surface grooves, and the other part of the back surface grooves are connected with a third chip structure. The invention further discloses a manufacturing method of the three-dimensional fan-out type packaging structure. The three-dimensional fan-out type packaging structure provided by the invention effectively solves the problems of warping and heat dissipation.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a three-dimensional fan-out packaging structure and a manufacturing method of the three-dimensional fan-out packaging structure. Background technique [0002] Packaging technology came into being along with the invention of integrated circuits, and its main functions are to complete power distribution, signal distribution, heat dissipation and protection. With the development of chip technology, packaging technology is constantly innovating. The packaging interconnection density continues to increase, the packaging thickness continues to decrease, and the three-dimensional packaging and system-level packaging methods continue to evolve. As emerging fields such as the Internet, Internet of Things, automotive electronics, high-performance computing, 5G, and artificial intelligence put forward higher requirements for advanced packaging, packaging technology is ...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L21/48H01L21/56H01L21/60
CPCH01L23/49822H01L23/49827H01L21/4857H01L21/486H01L24/81H01L21/56H01L2224/16225H01L2224/32225H01L2224/73204H01L2924/18161H01L2924/00
Inventor 戴飞虎王成迁段鹏超杨诚高艳
Owner WUXI ZHONGWEI GAOKE ELECTRONICS