PCBA needle bed testing machine and testing method

Abstract

The invention provides a PCBA needle bed testing machine and a testing method, and the testing method proposes the feasibility of leading out a part of testing signals to a testing device in other dimensions by reducing the density or number of testing points in a single dimension. According to the PCBA needle bed testing machine provided by the invention, the testing machine comprises a horizontal testing assembly and a vertical testing assembly, the horizontal testing assembly is used for testing a tested card in the horizontal dimension by the testing machine, and the vertical testing assembly is used for testing the tested card in the vertical dimension by the testing machine. According to the invention, the existing tested card terminal on the board card is used as a test interface of another dimension, so that additional test points are not needed when the PCB is designed, and the number of the test points of the needle bed of the test equipment and the processing difficulty are reduced. The technical scheme is low in cost, high in safety coefficient, rapid and efficient.

Description

technical field [0001] The invention belongs to the technical field of semiconductor testing equipment, and in particular relates to a PCBA bed of needles testing machine and a testing method. Background technique [0002] The current PCBA design is becoming more and more complex, and the board density is getting higher and higher. In order to test the integrity of the signal, more and more test point signals are required, which increases the difficulty of PCBA design. [0003] At present, the semiconductor test equipment using bed of needles test can only move in one dimension to complete the test. As a result, when the test point density of the board under test is very high, the processing accuracy of the needle bed of the test equipment is getting higher and higher. The processing cycle will also become less and less able to meet the needs of production. Moreover, if the density of test points is too high, it will be difficult to process, which will easily increase the d...

AI Technical Summary

Problems solved by technology

[0002] The current PCBA design is becoming more and more complicated, and the board density is getting higher and higher. In order to test the integrity of the signal, more and more test point signals are required, which increases the difficulty of PCBA design.

[0003] At present, the semiconductor testing equipment that uses the bed of needles test can only move in one dimension to complete the test. As a result, when the test point density of the tested board is high, the processing accuracy of the needle bed of the test equipment is getting higher and higher. The processing cycle will become increasingly unable to meet the needs of production

Moreover, the density of test points is too high, which will make processing difficult, easily increase the defective rate, and increase processing costs

[0004] During use, when the test points are too dense, there is a risk of short circuit caused by contact between thimbles

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