Crystal grain welding device adopting lens array and welding method
A lens array, welding device technology, applied in welding/welding/cutting items, welding equipment, laser welding equipment, etc., can solve the problems of low work efficiency, low utilization rate of laser energy, long time consumption, etc., to improve energy utilization efficiency, and the effect of ensuring the efficiency of die welding operations
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Embodiment 1
[0032] see figure 1 and figure 2 , the present embodiment provides a die bonding device using a lens array, which is used for soldering the die 10 on the target substrate 20 .
[0033] Among them, the die 10 is a Micro LED or Mini LED, and the die 10 can be fabricated on a wafer substrate made of sapphire and other materials through epitaxy and photolithography. An electrode 10 a is provided on the die 10 . In the example, each die 10 is provided with two electrodes 10a, corresponding to the positive and negative electrodes; the target substrate 20 is a substrate made of TFT material, or a PCB substrate (printed circuit board), and the surface of the target substrate 20 is provided with corresponding electrodes 10a. The pad 20a of the electrode 10a of the chip 10 is formed.
[0034] The die welding device using a lens array includes a laser welding mechanism 1 and a substrate 2 for transferring and focusing.
[0035] Among them, the laser welding mechanism 1 includes a las...
Embodiment 2
[0049] see image 3 , the present embodiment provides a die bonding method using a lens array, which is used for soldering the die on the target substrate.
[0050] Among them, the die is Micro LED or Mini LED, and the die can be produced on a wafer substrate made of sapphire and other materials through epitaxy and photolithography. Electrodes are provided on the die. In this embodiment, each Two electrodes are arranged on the die, corresponding to the positive and negative electrodes; the target substrate is a substrate made of TFT material, or a PCB substrate (printed circuit board), and the surface of the target substrate is provided with pads corresponding to the electrodes of the die.
[0051] The die welding method using a lens array includes the following steps:
[0052] S1. Through the transfer technology, the crystal grains are arranged in an array on the transfer surface of the substrate for transfer and focusing;
[0053] S2, bringing the transfer and focusing sub...
Embodiment 3
[0068] see Figure 4, this embodiment provides a die bonding device using a lens array. Compared with the die bonding device using a lens array provided in the first embodiment, the differences are:
[0069] In this embodiment, the lens array 22 is disposed on the other surface of the transfer and focusing substrate 2 opposite to the transfer surface 21, and each convex lens unit of the lens array 22 is directly molded on the transfer surface by integral molding or etching. and the surface of the substrate 2 for focusing, so that the lens array 22 and the substrate 2 for transferring and focusing constitute an integral structure.
[0070] The transfer surface 21 of the transfer and focusing substrate 2 is provided with a glue material layer; in this embodiment, the glue material layer covers the surface of the transfer and focusing substrate 2 , so that the die 10 can be adhered to the transfer surface 21 .
[0071] The remaining parts of the die bonding device using the lens...
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Abstract
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