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Electroforming molding and punching integrated porous copper foil manufacturing system and method

A manufacturing system and copper foil technology, applied in electroforming, electrolytic components, electrolytic process, etc., can solve the problems of low copper foil hole efficiency and surface quality, low process flexibility, etc., to improve the dissolution localization, quality and The effect of high precision and high electrochemical dissolution rate

Active Publication Date: 2022-07-01
HENAN POLYTECHNIC UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies in the existing porous copper foil preparation, such as low process flexibility, poor efficiency and surface quality of the prepared copper foil holes, the present invention proposes a porous copper foil manufacturing system integrating electroforming and punching and method

Method used

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  • Electroforming molding and punching integrated porous copper foil manufacturing system and method
  • Electroforming molding and punching integrated porous copper foil manufacturing system and method
  • Electroforming molding and punching integrated porous copper foil manufacturing system and method

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Embodiment Construction

[0028] The present invention will be further explained below in conjunction with the specific drawings.

[0029] like figure 1 , figure 2 and image 3As shown, an electroforming and punching integrated porous copper foil manufacturing system includes an electroforming unit I composed of an electroforming power source 15, a copper foil 3, and a guide roller 4, an electrolyte 17, a separator 18 The electrolyte circulation unit III composed of the electrolytic cell 19, the centrifugal pump 20, and the overflow valve 21 is characterized in that: it also includes an electrolytic hole-making unit II; , arc-shaped permanent magnet 7, copper foil winding roller 8, movable mask belt 9, arc-shaped cathode 10, solution tank 11, first mask belt tension roller 12, second mask belt tension roller 13, The mask belt driving roller 14, the electrolytic power supply 16; the copper foil 3 with a width of 100 mm and a thickness of 0.006 mm is in a tensioned state and is successively guided by...

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Abstract

The invention discloses an electroforming and punching integrated porous copper foil manufacturing system and method, and belongs to the technical field of porous copper foil processing. The system comprises an electroforming unit I, an electrolytic hole making unit II and an electrolyte circulating unit III, wherein the electrolytic hole making unit II comprises a copper foil conveying roller, a copper foil pressing roller, an arc-shaped permanent magnet, a copper foil winding roller, a movable mask belt, an arc-shaped cathode, a first mask belt tensioning roller, a second mask belt tensioning roller, a mask belt driving roller and an electrolytic power supply. During processing, the copper foil is wound on the winding roller after passing through the rollers and the movable mask belt, and the spatial position of each roller is adjusted, so that the copper foil is tightly pressed and attached to each part; opening an overflow valve, and spraying the electrolyte to the movable mask belt at a high speed; and turning on a power supply, dissolving the copper material in the exposed area, and gradually forming the through holes from the micro pits along with the forward movement of the mask belt. According to the invention, integration, continuity and synchronization of copper foil forming and punching can be realized, the process flexibility and adaptability are improved, and the high-quality and high-efficiency preparation requirements of the copper foil with massive holes are met.

Description

technical field [0001] The invention relates to a porous copper foil manufacturing system and method integrating electroforming and punching, and belongs to the field of porous copper foil processing. Background technique [0002] Copper foil is an important material for lithium battery manufacturing. Punching micro-holes on the surface of copper foil can reduce the weight of copper foil required in lithium batteries, improve the capacity and cycle performance of lithium batteries, and increase the coating amount of surface electrode materials to ensure that the battery reliability. [0003] At present, the fabrication methods of copper foil micro-holes include: mechanical drilling (see Chinese patent CN214110666U), chemical etching (see Chinese patent CN109440108B), and laser perforation (see Chinese patent CN109877470A). The mechanical drilling uses a punching machine. Due to the thin copper foil, the mechanical drilling has the problems of easy deformation of the foil, u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25F3/14C25F7/00C25D1/04
CPCC25F3/14C25F7/00C25D1/04Y02E60/10
Inventor 明平美李冬冬周涛李真明张云燕闫亮郑兴帅杨广宾杨晓红牛屾
Owner HENAN POLYTECHNIC UNIV
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