Flexible thermal diode and preparation method and application thereof

A thermal diode and flexible technology, applied in the field of flexible thermal diode, its preparation, can solve the problems of restricting wide application and inability to obtain flexibility, etc., and achieve the effect of wide application prospect, easy large-scale production, and small working temperature difference

Active Publication Date: 2022-07-01
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the phase-change thermal diodes currently reported are all packaged with phase-change materials in plastic tubes, and the assembled thermal diodes are rigid (Mater.Horiz., 2015, 2, 125-129; Adv.Energy Mater.2018, 8, 1702692), the flexibility cannot be obtained, which limits its wide application

Method used

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  • Flexible thermal diode and preparation method and application thereof
  • Flexible thermal diode and preparation method and application thereof
  • Flexible thermal diode and preparation method and application thereof

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preparation example Construction

[0050] Another aspect of the embodiments of the present invention also provides the aforementioned method for preparing a flexible thermal diode, which includes:

[0051] The negative temperature coefficient phase change material and the positive temperature coefficient phase change material are respectively loaded into the holes of the aerogel film, so as to obtain the first phase change composite film and the second phase change composite film respectively;

[0052] And, the first phase change composite film and the second phase change composite film are assembled to form the flexible thermal diode.

[0053] Further, the aerogel film is a high-strength, flexible self-supporting aerogel film.

[0054] In some specific embodiments, the preparation method specifically includes: using capillary action to load the negative temperature coefficient phase change material in a molten state or a solution state into the inside of the aerogel film to prepare a first phase change composi...

Embodiment 1

[0068] Paraffin (paraffin) and PNIPAM aqueous solution were selected as negative temperature coefficient phase change materials and positive temperature coefficient phase change materials with opposite thermal conductivity temperature coefficients, respectively, and then loaded into Kevlar aerogel films of different thicknesses, respectively, to obtain paraffin / Kevlar The phase-change composite film and the PNIPAM / Kevlar phase-change composite film, with a thickness ratio of 1:10, were cut into the same size, attached together, and assembled into a flexible thermal diode. figure 2 A schematic structural diagram of the flexible thermal diode obtained in this embodiment is shown, and other parameters are shown in Table 1.

Embodiment 2

[0070] Paraffin (paraffin) and PNIPAM aqueous solution were selected as negative temperature coefficient phase change materials and positive temperature coefficient phase change materials with opposite thermal conductivity temperature coefficients, respectively, and then loaded into the densified Kevlar aerogel films, respectively, to obtain paraffin / D-Kevlar phase change composite film and PNIPAM / D-Kevlar phase change composite film, the thickness ratio of the two is 1:5, they are cut into the same size, and they are laminated together to assemble a flexible thermal diode. Please refer to Table 1 for detailed parameters.

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Abstract

The invention discloses a flexible thermal diode and a preparation method and application thereof. The flexible thermal diode comprises a first phase-change composite film and a second phase-change composite film which have different thermal conductivity temperature coefficients, the first phase-change composite film and the second phase-change composite film are in thermal contact with each other, and the first phase-change composite film and the second phase-change composite film are stable in form and have flexibility before and after phase change. The heat conductivity of the first phase-change composite film and the heat conductivity of the second phase-change composite film are in opposite trends along with temperature changes, and the phase-change temperature difference value of the first phase-change composite film and the second phase-change composite film is smaller than 10 DEG C; the first phase change composite film and the second phase change composite film are opposite in surface wettability and incompatible in interface. Compared with a traditional thermal diode, the flexible thermal diode provided by the invention can be attached to a curved surface or an irregular surface needing thermal management in a conformal manner, the application field of a phase change film is expanded, and the practicability of the thermal diode is improved.

Description

technical field [0001] The invention belongs to the technical field of thermal management materials, and in particular relates to a flexible thermal diode, a preparation method and application thereof. Background technique [0002] Similar to electronic diodes, thermal diodes also contain two poles, the temperature input and the temperature output. When one pole is connected to the hot end and the other pole is connected to the cold end, the heat flow is J f , after the positions of the cold and hot ends are exchanged, the heat flow is J r , if J f with J r The values ​​are not equal, breaking the Fourier's law, this phenomenon is called thermal rectification, and this component is called thermal diode (see patent CN111895827A). Although the current thermal management materials can have both heat conduction and energy storage functions (CN111439001A), the thermal rectification function of thermal diodes can better control heat transfer, and has broad application prospect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04
CPCF28D15/046Y02E60/14
Inventor 张学同吕婧
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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