High-frequency module
A technology of high-frequency modules and module substrates, applied in transmission systems, electrical components, etc., can solve problems such as HBT thermal runaway
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no. 1 example
[0035] refer to 1A to 5D , the high-frequency module of the first embodiment will be described.
[0036] Figure 1A is a diagram showing the positional relationship of each component of the high-frequency module 20 according to the first embodiment in a plan view, Figure 1B It is a figure which shows typically the cross-sectional structure of the high frequency module 20. FIG. On the module substrate 21 are mounted the semiconductor device 30 , the output matching circuit 60 , the band selection switch 68 , the plurality of duplexers 70 , the low noise amplifier 71 , the antenna switch 72 , and a plurality of other surface mount type passive elements (ie, Surface Mount Parts (SMD)). The semiconductor device 30 includes a first member 31 and a second member 32 bonded to the first member 31 in surface contact. For example, the first member 31 is formed of an elemental semiconductor system, and the second member 32 is formed of a compound semiconductor.
[0037] The first u...
no. 2 example
[0093] Next, refer to Image 6, the high frequency module according to the second embodiment will be described. Below, for and reference 1A to 5D The high-frequency module according to the first embodiment described with reference to the drawings has the same structure, and the description is omitted.
[0094] Image 6 It is a figure which shows the positional relationship in the top view of each component of the high frequency module 20 based on 2nd Example. In the first embodiment ( Figure 1A ), in plan view, the semiconductor device 30 and the band selection switch 68 are arranged at positions opposite to two mutually adjacent edges of the output matching circuit 60, respectively. On the other hand, in the second embodiment, the semiconductor device 30 and the band selection switch 68 are arranged at positions opposite to the two parallel edges of the output matching circuit 60 in plan view. That is, the output matching circuit 60 is arranged at a position sandwiched ...
no. 3 example
[0099] Next, refer to 7A to 8B , the high-frequency module according to the third embodiment will be described. Below, for and reference 1A to 5D The same structure of the high-frequency module according to the first embodiment described in the accompanying drawings is omitted.
[0100] Figure 7A is a diagram showing the positional relationship of each component of the high-frequency module 20 according to the third embodiment in a plan view, Figure 7B It is a figure which shows typically the cross-sectional structure of the high frequency module 20. FIG. In the first embodiment ( Figure 1A , Figure 1B ), the output matching circuit 60 is constituted by an integrated passive device in which a plurality of passive elements are integrated. On the other hand, in the third embodiment, some of the passive elements are formed of the metal pattern provided on the module substrate 21, and the other passive elements are formed of individual surface mount components (ie, surf...
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