Packaging substrate deformation measurement equipment and method thereof

Abstract

The invention discloses a packaging substrate deformation measurement device and method, and relates to the technical field of packaging substrate measurement, the upper end of a machine body is provided with a marble platform, the upper end of the marble platform is provided with a precision hollow motion platform, and the upper end of the precision hollow motion platform is in driving connection with a measurement clamping module; a sample tray is clamped at the upper end of the measurement clamping module, a portal frame is installed on the rear side of the upper end of the marble platform, a measurement module is installed on the upper middle portion of the portal frame and located above the measurement clamping module, and a wired laser sensor, an upper correlation laser sensor and a visual sensor are installed at the lower end of the measurement module; a supporting seat is arranged at the inner middle part of the measurement clamping module and the precise hollow motion platform and is positioned at the upper end of the marble platform; an adjusting bracket is vertically arranged on the supporting seat; the bijection laser sensor and the linear scanning laser sensor measurement module are integrated into the same equipment, so that accurate measurement of two-dimensional and three-dimensional dimensions can be simultaneously carried out.

Description

technical field [0001] The invention relates to the technical field of package substrate measurement, in particular to a package substrate deformation measurement device and a method thereof. Background technique [0002] The package substrate is the carrier of semiconductor chip packaging. The substrate can provide electrical connection, protection, support, heat dissipation, assembly and other functions for the chip to achieve multi-pin, reduce the size of packaged products, improve electrical performance and heat dissipation, ultra-high density or The purpose of multi-chip modularization. Chip packaging involves processes that require high temperature such as substrate baking, preheating, curing, molding, and reflow soldering, and will experience repeated heating, constant temperature and cooling processes. Since the chip is a mixture of copper, board core and other materials , the thickness is thinner, and with the development of the process, the number of layers of the...

AI Technical Summary

Problems solved by technology

[0003] At present, the packaging substrates include: 1. Traditional manual contact measurement methods, such as vernier calipers, micrometers, etc., the measurement error may be large, and the calculation will lead to further accumulation of errors, and the measurement accuracy is difficult to guarantee. The measurement may affect the measured object itself

[0004] 2. In the industry, laser measurement is mostly used to complete precision measurement. Many devices or sensors can measure the thickness of different positions of the mold seal, the three-dimensional dimensions of the mold seal surface and other parameters, but the accuracy of existing such equipment when measuring thickness is not as good as Based on the reference plane, the parameters such as the expansion rate and warpage of the object need to be indirectly calculated by a third party based on the measurement results

And the function is single. In order to complete the above measurement, it is necessary to purchase multiple types of machines for use together, and this type of machine usually has no open interface or the interface is not friendly, and the scalability and upgradeability are low.

In addition, the measurement of the molded substrate needs to select different measurement areas according to different types of substrates. The selection of the measurement area needs to be manually identified, which also leads to the difficulty of automatic measurement.

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