Probe clamp suitable for semiconductor chip test system

Abstract

The invention discloses a probe clamp suitable for a semiconductor chip test system, and relates to the technical field of semiconductor photoelectronics, the probe clamp comprises a base and a movable clamping device, the movable clamping device is adjustably arranged on the base, the movable clamping device is provided with a clamping assembly used for clamping a probe, and when the probe needs to be replaced, the clamping assembly is used for clamping the probe. The movable clamping device is used for clamping the probe to return to the initial position, the probe can be replaced by releasing the clamping assembly, operation is easy and convenient, the replacement speed of the probe is effectively increased, the polishing efficiency of the probe is effectively improved, the smooth degree of a product is higher, and the yield is increased.

Description

technical field [0001] The invention relates to the technical field of probe fixtures, in particular to a probe fixture suitable for a semiconductor chip testing system. Background technique [0002] In recent years, semiconductor process technology has advanced by leaps and bounds, ahead of Moore's Law predictions by several years, and at this stage, it has advanced to below 7 nanometers. The products are light, thin and short. The IC volume is getting smaller, the function is stronger and the number of pins is increasing. In order to reduce the area occupied by the chip package and improve the IC performance, the flip chip package is generally used in graphics chips at this stage. , chipset, memory and CPU, etc. The unit price of the above-mentioned high-end packaging methods is high. If chip testing can be performed before packaging and it is found that there are defective products in the wafer, it will be marked until the subsequent packaging process. Discarding good pr...

AI Technical Summary

Problems solved by technology

Products are thin, light and compact. ICs are becoming smaller and more powerful, and the number of pins is increasing. In order to reduce the area occupied by chip packaging and improve IC performance, flip-chip packaging is generally used in graphics chips at this stage. , chipset, memory and CPU, etc., the unit price of the above-mentioned high-end packaging method is high. If the chip test can be carried out before packaging, if there are defective products in the wafer, they will be marked, and these marked products will be marked until the subsequent packaging process. Good products are discarded, which can save unnecessary packaging costs

[0003] During the production and processing of the test probe, it needs to be polished to make the probe more slender and smooth, but the structure of the probe is small, so it is inconvenient for the staff to hold the polishing, and it is impossible to perform different degrees of grinding and polishing effects, making the polishing The effect is not good, resulting in insufficient smoothness of the product, which further reduces the yield. Therefore, we propose a probe fixture suitable for semiconductor chip testing systems to solve the above problems

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