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Graphite-copper composite material, heat sink member using same, and method for producing graphite-copper composite material

A composite material and manufacturing method technology, applied in the field of graphite-copper composite material manufacturing, can solve the problem of high thermal expansion rate and achieve the effect of high thermal conductivity and stable thermal conductivity

Pending Publication Date: 2022-07-15
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although copper has a high thermal conductivity, it also has a high thermal expansion rate

Method used

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  • Graphite-copper composite material, heat sink member using same, and method for producing graphite-copper composite material
  • Graphite-copper composite material, heat sink member using same, and method for producing graphite-copper composite material
  • Graphite-copper composite material, heat sink member using same, and method for producing graphite-copper composite material

Examples

Experimental program
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Effect test

Embodiment 1

[0071] by reference figure 2 By the method described, pretreatment (thinning) was performed on commercially available graphite particles, and scaly graphite particles having a thickness of 50 μm or less were obtained. The mesh size of the sieve 21 was about 53 μm, and the grindstone 22 used corundum or natural diamond as abrasive grains. The obtained scaly graphite particles were dried with a dryer. On the other hand, as copper particles, copper particles having a median particle diameter of 1.5 μm were prepared.

[0072] 15.33 g of flaky graphite particles after pretreatment and drying were mixed with 15.19 g of copper particles so that the volume fraction of sintered copper was 20% to obtain molding raw materials. These powders were accommodated in a 250 mL eggplant-shaped flask together with 50 mL of toluene as a solvent, and were desolvated and mixed with an evaporator.

[0073] 3 g of the molding raw material was put into a SUS mold having a diameter of 30 mm, and the p...

Embodiment 2

[0079] A composite material of Example 2 was produced in the same manner as in Example 1, except that the molding raw material was changed so that the volume fraction of copper after sintering was 16%.

Embodiment 3

[0081] A composite material of Example 3 was produced in the same manner as in Example 1, except that the molding raw material was changed so that the volume fraction of copper after sintering was 10%.

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Abstract

A graphite-copper composite material which comprises a copper layer having an average thickness of 15 [mu] m or less and scale-like graphite particles laminated via the copper layer, has a copper volume fraction of 3-20%, and is characterized by being provided with (A) or (B) described below. (A) The copper layer contains copper crystal grains having an average particle diameter of 2.8 [mu] m or less, the mass fraction of Al being less than 0.02%, and the mass fraction of Si being less than 0.04%. (B) The gap at the interface between the copper layer and the scale-like graphite particles is 150 nm or less.

Description

technical field [0001] The present invention relates to a graphite-copper composite material, a heat sink member using the graphite-copper composite material, and a method for producing the graphite-copper composite material. Background technique [0002] Materials for heat-dissipating members of semiconductor devices are required to have high thermal conductivity. Although copper has a high thermal conductivity, it also has a high thermal expansion rate. A metal-graphite composite material has been proposed as a composite material obtained at low cost by reducing the thermal expansion coefficient without impairing the high thermal conductivity of copper (for example, see Patent Document 1). It is also disclosed that the metal-graphite composite material of Patent Document 1 has high cooling reliability and low coefficient of linear expansion. [0003] prior art literature [0004] Patent Literature [0005] Patent Document 1: Japanese Patent Laid-Open No. 2017-128802 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/10B22F1/12H01L23/36H01L23/373C22C1/05C01B32/21H05K7/20B22F3/14
CPCC01B32/21H01L23/373C01P2006/32C01P2006/90C01P2004/60C22C9/00C22C32/0084B22F2998/10C22C1/0425H01L23/3735H01L23/3736B22F1/12C22C1/05B22F3/02B22F3/105C01P2004/03C01P2004/20C01P2004/61C09K5/14
Inventor 吉村正文稻森太砂本健市
Owner UBE IND LTD
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