Grinding wheel feeding device and silicon wafer thinning machine
A technology of feeding device and grinding wheel, which is applied in the direction of grinding drive device, parts of grinding machine tool, machine tool suitable for grinding workpiece plane, etc. Low yield rate and other problems, to achieve the effect of simple structure, reducing stress cracks and improving product quality
Pending Publication Date: 2022-07-29
苏州明昌正光电科技有限公司
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Problems solved by technology
However, the feeding accuracy of the grinding wheel driven by the motor screw mechanism is difficult to meet the existing process requirements, and it is easy to cause micro-cracks on the surface of the silicon wafer. Finally, a polishing process is required to remove the micro-cracks. The process is relatively complicated, and the final product is good. low rate
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[0023] The present invention will be described in detail below with reference to the various embodiments shown in the accompanying drawings. Figure 1 to Figure 2 shown, is the preferred embodiment of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. For those of ordinary skill in the art, under the premise of no creative effort, other The embodiments of the present invention fall within the protection scope of the present invention.
[0024] It should be noted that the terms first, second, third, etc. in the present invention are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features; in addition, unless Unless otherwise specified and defined, the term "connection" should be understood in a broad sense, for example, the connection may be a direct connection or an in...
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The invention provides a grinding wheel feeding device and a thinning machine, the grinding wheel feeding device comprises a fixed seat, a grinding head and a fine adjustment mechanism arranged between the fixed seat and the grinding head, the fine adjustment mechanism comprises a first moving block, a second moving block and a third moving block, the first moving block is slidably connected to the fixed seat in the first direction of the horizontal direction; the second moving block is fixed on the grinding wheel main shaft, and the second moving block is matched with the inclined surface of the first moving block; the limiting guide piece enables the second moving block to only move in the vertical direction; the first driving assembly drives the first moving block to move in a reciprocating mode in the first direction, and when the first moving block moves in the first direction, the second moving block is driven to move in the vertical direction; the grinding wheel feeding device is simple in structure, the longitudinal movement precision of the grinding head can be improved, high-precision movement of the grinding head in the Z-axis direction is achieved, and the grinding wheel feeding device can conduct micro-feeding.
Description
technical field [0001] The invention relates to the field of semiconductor processing and production, in particular to a grinding wheel feeding device and a silicon wafer thinning machine. Background technique [0002] The development of integrated circuit manufacturing process has stricter and stricter requirements on the quality of materials such as silicon wafers. The waviness and thickness of the material surface can only be achieved through the thinning process, so the thinning machine has become an indispensable special equipment. With the development of integrated circuits in the direction of being shorter and thinner, the use of thinner silicon wafers in packaging has become inevitable. [0003] The grinding wheel feeding device in the existing silicon wafer thinning machine is generally set as a set of motor screw mechanism that drives the grinding wheel to move up and down. However, the feed accuracy of the grinding wheel driven by the motor screw mechanism is dif...
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IPC IPC(8): B24B7/22B24B47/20B24B47/22B24B47/26B24B41/047H01L21/304
CPCB24B7/22B24B47/22B24B47/20B24B47/26B24B41/047H01L21/304
Inventor 程晔孙庆平
Owner 苏州明昌正光电科技有限公司