Developing device capable of preventing back flow of developing solution

Abstract

The developing device comprises a vacuum suction head, a baffle plate, a drainage structure, a negative pressure pipe, a retainer guide rail, a retainer, a push rod and a distance sensor, the vacuum suction head is mounted on a motor shaft; the motor and the baffle are both fixed to the upper portion of the base. The drainage structure is mounted on the upper surface of the baffle; the rear end of the negative pressure pipe is connected with the hole in the upper portion of the baffle. The retainer guide rail is mounted in a groove in the top end of the baffle; the retainer is connected with the upper surface of the retainer guide rail; and the distance sensor is positioned above the wafer. The invention has the following beneficial effects: the negative pressure suction force of the original vacuum suction head of the equipment is ingeniously utilized to drain and collect the redundant developing solution, so that the developing solution is prevented from flowing into the back surface of the wafer, and the process safety is guaranteed; the drainage process of the developing solution can be automatically adjusted in real time in the whole process, so that the adjustment is more accurate and reliable; and by adopting double-layer protection of the drainage structure and the protective ring with the inclined plane, the drainage effect of the developing solution is enhanced, so that the equipment safety is better guaranteed.

Description

technical field [0001] The invention relates to the field of wafer manufacturing, in particular to a developing device capable of preventing backflow of developing solution. Background technique [0002] Wafers are the main raw material for chips. Wafer production is a very basic and very important part of the semiconductor industry. The original material of the wafer is silicon, which is usually produced by single crystal straight method, that is, high-purity polysilicon is grown on the daughter crystal to form a cylindrical silicon rod, and then the silicon rod is polished and sliced ​​to form a preliminary wafer. Before the wafer is divided into wafers, processing steps such as coating, exposure, and development need to be performed on the surface of the wafer. In the developing process, a developing solution is used to develop the graphics transferred to the photosensitive material, and the quality of the developed graphics has a great influence on the subsequent proce...

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Problems solved by technology

However, there will be contact between the retainer and the wafer. The wafer rotates around the axis and the retainer is fixed with the rotating baffle, which will inevitably cause friction and damage the wafer; the position of the retainer may be adjusted by the movable rotating baffle. Because of its own elasticity, the baffle will be brought back, causing the retainer and the wafer to not be on the same level, which will affect the blocking effect; the adjustment of the baffle is manual and real-time adjustment, and it is very important to ensure the accuracy of manual adjustment during the wafer rotation process. difficulty

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