Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Polling system and method for optimizing temperature of storage medium under storage card

A technology for optimizing storage and storage media, applied in the field of server storage, it can solve the problem of BMC modules occupying I2C bus channels, etc., and achieve the effect of improving heat dissipation control, reasonable adjustment, and meeting heat dissipation requirements.

Pending Publication Date: 2022-08-02
INSPUR SUZHOU INTELLIGENT TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The present invention provides an optimized storage medium temperature polling system under the memory card, which solves the problem that the BMC module continues to occupy the I2C bus channel, and optimizes the polling rate of other devices and hard disk temperature information under the bus

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polling system and method for optimizing temperature of storage medium under storage card
  • Polling system and method for optimizing temperature of storage medium under storage card
  • Polling system and method for optimizing temperature of storage medium under storage card

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0051] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0052] The units and algorithm steps of each example described in the embodiments disclosed in the system and method for optimizing the storage medium temperature polling under the memory card involved in the present invention can be implemented by electronic hardware, computer software or a combination of the two. Illustrating the interchangeability of hardware and software, the components and steps of each example have been generally...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a polling system and method for optimizing the temperature of a storage medium under a storage card. The polling system comprises a BMC module and a storage assembly. The storage assembly is provided with a data buffer module and a memory; the data buffer module is in communication connection with the memory, and the data buffer module obtains memory temperature information in a preset time period and stores the memory temperature information; setting a temperature acquisition polling period of the BMC module to the storage component, and configuring an acquisition time point in the temperature acquisition polling period; the BMC module is in communication connection with the data buffer module, the BMC module sends a memory temperature information acquisition instruction to the data buffer module at an acquisition time point in a temperature acquisition polling period, and the data buffer module feeds back the memory temperature information in the current temperature acquisition polling period to the BMC module. According to the method, the polling rate of the hard disk temperature is increased, heat dissipation regulation and control of the hard disk are improved for models with high requirements for hard disk temperature reading, and the running stability of a server is improved.

Description

technical field [0001] The present invention relates to the technical field of server storage, in particular to a system and method for optimizing the temperature of a storage medium under a memory card. Background technique [0002] With the rapid development of technology, big data has penetrated into every industry and business function today. The sharp increase in the amount of information requires the server to have higher and higher data storage capacity, so the number of hard disks mounted in the storage server is increasing. Usually, the server will match more hard disks through memory cards and hard disk Expander backplanes to improve data storage capacity. [0003] The server motherboard BMC connects the memory card through I2C, and reads the information of the memory card and the hard disk mounted after it. This information is mainly used to display the BIOS interface of the memory card, including relevant manufacturing information, memory card and hard disk temp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/30
CPCG06F11/3058G06F11/3037Y02D10/00
Inventor 刘海亮
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products