Splicing groove, diamond wire slicing machine and cutting method of large-size silicon rod

Abstract

The invention relates to the technical field of diamond wire slicing machines, in particular to a piece receiving groove, a diamond wire slicing machine and a cutting method of a large-size silicon rod.The diamond wire slicing machine comprises a left cutting main roller, a right cutting main roller and the piece receiving groove, and the piece receiving groove comprises a groove body used for containing cooling liquid and arranged between the two cutting main rollers; the groove body comprises two groove side walls arranged left and right and a groove bottom wall connected between the two groove side walls, side wall ultrasonic vibration plates are fixed on the two groove side walls in the groove body respectively, and a bottom wall ultrasonic vibration plate is fixed on the groove bottom wall in the groove body. According to the diamond wire slicing machine and the cutting method of the large-size silicon rod, the cutting force is higher, and the abnormity of TTV, line marks and the like of a silicon wafer is obviously lower than that of a conventional method; in the cutting process, the wire breaking rate is also remarkably reduced, the cutting efficiency is improved, the wire consumption is reduced, and the silicon wafer cutting machining cost is reduced; when the method is used for processing the large-size silicon rod, the cutting yield is remarkably improved, and a solution is provided for processing the large-size silicon rod.

Description

technical field [0001] The invention relates to the technical field of diamond wire slicers, in particular to a splicing groove, a diamond wire slicer and a method for cutting large-sized silicon rods. Background technique [0002] The processing of photovoltaic silicon wafers mainly depends on the diamond wire slicer. The diamond wire slicer uses tiny diamond particles fixed on the steel wire as the cutting tool. Equipment that uses cutting fluid for cooling. [0003] For example, a diamond wire slicer disclosed in Chinese Utility Model Patent No. CN209408997U includes a cutting mechanism and a feeding mechanism located above the cutting mechanism. The cutting mechanism includes two main rollers arranged in parallel, and between the two main rollers The diamond wire is spirally wound, and the diamond wire forms a wire mesh, and the silicon rod to be cut is installed at the bottom of the feeding mechanism. The diamond wire moves under the driving of the two main rollers, t...

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Problems solved by technology

[0010] The purpose of the present invention is to provide a splice groove to solve the problems of low cutting yield and high slicing cost of large-size silicon rods in the prior art; Diamond wire slicing machine; the object of the present invention is also to provide a cutting method for large-size silicon rods, so as to solve the problems of low cutting yield and high slicing cost of large-size silicon rods in the prior art

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