Electronic apparatus, integrated circuit, and semiconductor device
A technology of integrated circuits and electronic equipment, which is applied in the direction of semiconductor devices, electric solid devices, semiconductor/solid device components, etc. It can solve the problems of easy increase of contact thermal resistance and affect the heat dissipation of packaged chips, so as to improve the heat dissipation effect and enhance the Performance, the effect of ensuring the cooling effect
Pending Publication Date: 2022-08-09
XFUSION DIGITAL TECH CO LTD
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Problems solved by technology
[0004] However, in the related art, the contact thermal resistance between the bare chip and the package cover is easy to increase, which affects the heat dissipation of the packaged chip.
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[0092] The terms used in the embodiments of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application. The following will describe the embodiments of the embodiments of the present application in detail with reference to the accompanying drawings.
[0093] Printed circuit boards (PCB), also known as printed circuit boards, are providers of electrical connections for electronic passive components. The chip is the most core part of electronic equipment, and it has the function of logic processing and control of the normal operation of the whole machine. In electronic equipment, the chip is mainly fixed on the printed circuit board in the form of a chip package structure to play a stable role. The purpose of controlling the stable conduction between the chip inside the chip package structure and the external printed circuit board. Flip Chip is not only a chip interconnection technolo...
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The embodiment of the invention provides electronic equipment, an integrated circuit and a semiconductor device. The semiconductor device comprises a substrate; a die connected to the substrate; the bare chip is located in the heat conduction shell; and a first thermal interface material; the heat conduction shell comprises a first component and a second component. The second component is fixed on the substrate around the bare chip, and the first component is located in a through hole formed in the top wall of the second component; a first lap joint part is formed on the part, close to the base plate, of the edge of the first component, a second lap joint part is formed on the top wall of the second component, the first lap joint part is in lap joint with the second lap joint part, and the first lap joint part is located between the second lap joint part and the base plate; the first thermal interface material is located between the first component and the die for conducting heat generated by the die to the first component. Therefore, the contact thermal resistance between the bare chip and the heat conduction shell of the semiconductor device can be reduced, and the heat dissipation effect of the semiconductor device is improved.
Description
technical field [0001] The embodiments of the present application relate to the technical field of integrated circuit packaging, and in particular, to an electronic device, an integrated circuit, and a semiconductor device. Background technique [0002] With the development of electronic technology, the size, power consumption and package size of the chip are getting larger and larger, and the heat dissipation problem of the packaged chip has also attracted more and more attention. For example, if the junction temperature of a CPU (Central Processing Unit, CPU) chip of a server is lowered by 1 degree, the computing performance of the server will be greatly improved. [0003] In the related art, a packaged chip includes a substrate, a bare chip, and a package cover, the substrate and the package cover are enclosed to form an accommodating cavity, and the die is disposed in the accommodating cavity. The lower surface of the die is electrically connected to the upper surface o...
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IPC IPC(8): H01L23/367H01L23/373
CPCH01L23/367H01L23/3675H01L23/373
Inventor 江水木
Owner XFUSION DIGITAL TECH CO LTD