Method for coating metal on the surface of integrated circuit structure

Abstract

The present invention is the method of coating metal onto the surface of IC structure. The IC structure includes one substrate, one or more IC chips coupled to the substrate via gold wire, polycrystal or other material, and one coating covering at least the chips and near parts on the substrate. Through metal spraying, one metal coating is formed on partial non-conducting surface of the IC structure and before metal spraying some protecting film may be formed optionally. The sprayed metal coating, with required thickness altered via control, can reach excellent heat dissipating effect and electromagnetic shielding effect for the normal operation of the IC chips.

Description

technical field [0001] The invention relates to a method for coating metal on the surface of an integrated circuit structure, in particular to forming a surface coated metal layer on a part of the surface of the integrated circuit structure by means of metal spraying on an integrated circuit structure, and the thickness of the metal layer is According to practical needs, the parameters of the metal spraying process can be adjusted to achieve the required thickness and shape. Background technique [0002] With the continuous advancement of the electronics industry, electronic systems and electronic packages are usually designed to use the smallest space possible practically. Therefore, the space carrying the circuit is a valuable asset and should be utilized as much as possible; for this purpose, reducing the circuit is an effective way to make good use of the space, and the reducing circuit can also increase the operating speed, reduce noise and other manifestations The adv...

AI Technical Summary

Problems solved by technology

[0009] (1) For the heat sink, the metal sheet must first be punched, pressed, or molded to meet the heat sink type of the integrated circuit structure, and it must be fully compatible with the integrated circuit structure. Matching, the process is complicated and costly

[0010] (2) The production process requires a large number of expensive machines, wasting unnecessary costs

[0011] (3) In the case of complex integrated circuit packaging configurations, the production of heat sinks is difficult, the scope is severely limited, and error-prone

[0012] (4) The formation of the integrated circuit package by lamination of the heat sink needs to be carried out with a complex machine, and the auxiliary layer of the adhesive layer is required, which also increases the cost

[0013] (5) The production volume is low and it is not easy to mass produce

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