Method for coating metal on the surface of integrated circuit structure

A technology of integrated circuits and structural surfaces, applied in the direction of circuits, arc spraying, electrical components, etc., can solve a large number of expensive machines, costly, error-prone and other problems

Inactive Publication Date: 2003-10-15
VIA TECH INC
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] (1) For the heat sink, the metal sheet must first be punched, pressed, or molded to meet the heat sink type of the integrated circuit structure, and it must be fully compatible with the integrated circuit structure. Matching, the process is complicated and costly
[0010] (2) The production process requires a large number of expensive machines, wasting unnecessary costs
[0011] (3) In the case of complex integrated

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for coating metal on the surface of integrated circuit structure
  • Method for coating metal on the surface of integrated circuit structure
  • Method for coating metal on the surface of integrated circuit structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] One of the main technical features of the present invention is that the metal coating layer is formed by metal spraying, which is suitable for integrated circuit structures of various sizes.

[0027] see Figure 3A to B are the first embodiment of the present invention. Firstly, an integrated circuit structure 3 is provided. The integrated circuit structure 3 is a packaging form in the general industry. It mainly includes a substrate 31 and a chip 33 disposed thereon. Generally, the industry can install more than one chip according to needs, and then Only one chip 33 is shown in the figure. The substrate 31 can be a ceramic substrate or a plastic substrate, the ceramic substrate uses ceramic material as the insulating layer, and the plastic substrate uses the plastic substrate as the insulating layer. The material thereof is bismaleimide (BMI), bismaleimide / triple nitrogen trap composite resin. Bismaleimide triazine-based, BT), epoxy resin (epoxy) FR-4 or polyamide (...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Adhesionaaaaaaaaaa
Login to view more

Abstract

The present invention is the method of coating metal onto the surface of IC structure. The IC structure includes one substrate, one or more IC chips coupled to the substrate via gold wire, polycrystal or other material, and one coating covering at least the chips and near parts on the substrate. Through metal spraying, one metal coating is formed on partial non-conducting surface of the IC structure and before metal spraying some protecting film may be formed optionally. The sprayed metal coating, with required thickness altered via control, can reach excellent heat dissipating effect and electromagnetic shielding effect for the normal operation of the IC chips.

Description

technical field [0001] The invention relates to a method for coating metal on the surface of an integrated circuit structure, in particular to forming a surface coated metal layer on a part of the surface of the integrated circuit structure by means of metal spraying on an integrated circuit structure, and the thickness of the metal layer is According to practical needs, the parameters of the metal spraying process can be adjusted to achieve the required thickness and shape. Background technique [0002] With the continuous advancement of the electronics industry, electronic systems and electronic packages are usually designed to use the smallest space possible practically. Therefore, the space carrying the circuit is a valuable asset and should be utilized as much as possible; for this purpose, reducing the circuit is an effective way to make good use of the space, and the reducing circuit can also increase the operating speed, reduce noise and other manifestations The adv...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B05B5/06H01L21/50H01L23/34
CPCH01L2924/15311H01L2224/48091H01L2224/16225H01L2224/73204H01L2224/48227H01L2224/32225H01L2924/3025H01L2224/45144H01L2924/00014H01L2924/00
Inventor 宫振越
Owner VIA TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap