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Method and device for laser drilling laminates

A laser drilling and laminate technology, applied in laser welding equipment, processing of insulating substrates/layers, light-absorbing dielectrics, etc., can solve problems such as delamination and ablation of laminates, and achieve high processing speed and short processing. Effect of time, small heat load

Inactive Publication Date: 2005-01-05
HITACHI SEIKO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

while using CO 2 When the laser is used for laser drilling of organic materials, the organic materials undergo thermal decomposition, that is, ablation, and the risk of delamination of the laminate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0052] Blind vias with a diameter of 125 μm were machined with laser I on the upper 12 μm thick copper foil of material I and the 60 μm thick dielectric layer made of unreinforced epoxy material. The pulse frequency for copper layer drilling is 45 kHz or ≥ 30 kHz, and for dielectric layer drilling is 25 kHz or ≥ 20 kHz. The pulse length is 30 nanoseconds, or <40 nanoseconds. The pigment added in the organic material is between 0.1% and 5.0% by weight. Preferably, the pigment added in the organic material is between 1% and 2% by weight.

[0053] An area of ​​10 cm x 10 cm was processed with two galvanometer mirrors used to deflect the laser beam in the x- and y-directions. The laser beam for copper drilling moves in a small number of concentric circles in the outer hole area with a spot diameter of the focused laser beam of about 25 microns, and then automatically throws out the inner area. The diameter of the outer concentric circle is 110 microns. The linear velocity of t...

example 2

[0056] Unlike Example 1, Laser II with the same laser parameters was used. Here the copper foil was drilled at a rate of 145 holes per second, while the epoxy material was drilled at a rate of 122 holes per second. So drilling blind vias into laminate is done at a rate of 65 holes per second.

example 3

[0058] Unlike Example 1, blind vias were drilled into Material II, and the results were comparable.

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PUM

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Abstract

In order to laser drill laminates which comprise at least one metal layer and at least one dielectric layer made of an organic material, a frequency-doubled Nd vanadate laser is used that has the following parameters: pulse duration < 40 ns; pulse frequency > / = 30 kHz for the metal layer; > / = 20 kHz for the dielectric layer, and wavelength = 532 nm.

Description

technical field [0001] The invention relates to a laser drilling method and device for laminated boards. Background technique [0002] From EP-A-0 164 564 it is known to use an excimer laser to produce blind holes in a metal-dielectric-metal laminate. The uppermost metal layer of the laminate is used as a hole mask whose hole pattern is transmitted optically and subsequently produced by etching. The exposed dielectric in the hole area of ​​this mask is then removed by the action of an excimer laser until the lowest metal layer is reached and the process is terminated. This method is especially suitable for making through holes in the form of blind holes required for multilayer printed circuit boards. [0003] From the German magazine "Precision Instrument Technology and Measurement Technology" 91 (1983) 2, pages 56-58, a similar method for manufacturing multilayer printed circuit boards is known. This method uses a CO 2 A laser is used to create bl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/00B23K26/40B23K26/402B23K101/42H05K3/00
CPCH05K2203/0195H05K3/0038H05K2201/0112B23K26/403H05K3/0055B23K26/4085B23K26/40B23K2103/16B23K2103/30B23K2103/50H05K3/00
Inventor J·范普伊姆布雷克M·赫尔曼H·德施托伊尔
Owner HITACHI SEIKO LTD