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Production method for copper-clad laminated sheet

A technology of copper-clad laminates and manufacturing methods, which is applied in the direction of multilayer circuit manufacturing, lamination, and lamination devices, and can solve the problems of reducing the utilization rate of raw materials for products and poor etching accuracy, etc.

Inactive Publication Date: 2005-03-23
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is to say, the etching accuracy of the outer layer copper foil directly above the formed interstitial via hole (IVH) or blind via hole (BVH) will immediately deteriorate, thereby greatly reducing the raw material utilization rate of the product

Method used

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  • Production method for copper-clad laminated sheet
  • Production method for copper-clad laminated sheet
  • Production method for copper-clad laminated sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Here, the copper foil according to the first aspect of the present invention, that is, a VLP copper foil with a thickness of 18 μm classified as a very low profile type foil according to the IPC standard was used. The characteristic held by this VLP copper foil is that the tensile strength is 52 kg / mm 2 , The Vickers hardness is 150, the elongation after heating is 3.8%, and the breaking strength measured by the compression test after heating is 552 kN / m 2 .

[0040] The resin layer 3 with a thickness of 50 micrometers is formed on the rough-worked surface of the VLP copper foil with fine copper particles 2 attached, thereby producing the resin-attached copper foil 4 . When forming the resin layer 3, the resin composition that is dissolved in the formed solid content in methyl ethyl ketone with following chemical reagent is 45% resin composition: Resin is the bisphenol A type epoxy resin (trade name: EPOMIC R-301, manufactured by Mitsui Petrochemical Co., Ltd.), 20% b...

Embodiment 2

[0044] Here, use the copper foil described in the second aspect of the present invention, that is, the copper foil 10 with an erodible carrier foil, which forms a 3μ thick copper foil circuit on the side of the 25 micron thick aluminum carrier foil 8. The copper foil layer 9. The following parts are the same as those of the first embodiment, and the description thereof is omitted to avoid repetition. In addition, the same parts are denoted by the same symbols as those in the first embodiment as much as possible.

[0045] A resin layer 3 with a thickness of 100 microns is formed on the surface of the rough-worked copper foil layer 9 with fine copper particles 2 adhered to the copper foil 10, thereby making the attached foil with the resin layer copper foil11. At this time, since the resin used for forming the resin layer 3 is the same as that of the first embodiment, description thereof will be omitted.

[0046] Then, using this copper foil 11 with a resin layer, to Figure...

Embodiment 3

[0048] Here, the copper foil described in the third aspect of the present invention is used, that is, the copper foil 10 with a peelable carrier foil, which forms a 5μ thick copper foil circuit on the side of the 18 μm thick copper carrier foil 8. Copper foil layer 9, and carboxybenzotriazole is used to form joint interface layer 12 between carrier foil layer 8 and copper foil layer 9. The following parts are the same as those in the case of the first embodiment, and the description thereof is omitted to avoid repetition. In addition, the same parts are denoted by the same symbols as those in the first embodiment as much as possible.

[0049] A resin layer 3 with a thickness of 100 microns is formed on the surface of the rough-worked copper foil layer 9 with fine copper particles 2 adhered to the copper foil 10, thereby making the attached foil with the resin layer copper foil11. At this time, since the resin used for forming the resin layer 3 is the same as that of the firs...

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Abstract

An object of the invention is to prevent dent faults generated during bonding of an outer copper foil layer onto an inner layer substrate having a through hole or a cavity serving as an interlayer electrical connection means such as an interstitial via hole (IVH) or a blind via hole (BVH). In order to attain the object, there is provided a method for producing a copper-clad laminate employing the following copper foil serving as an outer layer: (1) a resin-coated copper foil being formed of copper foil having a thickness of 15 mum or more and a rupture strength of 275 kN / m2 or more as measured through a bulge test performed after the foil is heated, wherein the resin-coated copper foil has a resin layer on one side of the copper foil; (2) a copper foil with etchable carrier, wherein the total thickness of the carrier layer and the copper foil layer is 20 mum or more; or (3) a copper foil with peelable carrier, wherein the total thickness of the carrier layer and the copper foil layer is 20 mum or more, the releasing layer formed between the carrier layer and the copper foil layer having a peel strength of 5 gf / cm to 300 gf / cm as measured after heating.

Description

technical field [0001] The present invention relates to a method of manufacturing a copper clad laminate. Background technique [0002] Previously, as a means of obtaining interlayer conduction between the inner circuit layers of a multilayer printed circuit board, via holes as interstitial via holes (IVH) or as blind vias on inner circuit substrates could be used. Hole (blind via hole) (BVH) recesses and other devices. These interlayer conduction devices can form fine circuits of printed circuit boards, and are widely used as high-density packaging devices. [0003] Copper clad laminates or printed circuit boards with these interlayer vias such as interstitial via holes (IVH) and blind via holes (BVH) are manufactured by a build-up process in which the copper foil is repeatedly Paste to the outer layer of the printed circuit board as the core material, and finally form the inner layer circuit, thereby forming a copper foil circuit layer containing multiple layers, and sea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08H05K1/09H05K3/02H05K3/46
CPCH05K3/025B32B15/08B32B2457/08H05K3/4602B32B2311/12B32B37/0023H05K2201/09509Y10S428/914H05K3/4652H05K2201/0355H05K2201/0358H05K1/09Y10T428/1438Y10T428/24843Y10T428/24917Y10T428/2804H05K3/38B32B15/20
Inventor 桑子富士夫石野友宏
Owner MITSUI MINING & SMELTING CO LTD