High density electric connector and method of manufacture
A technology of electrical connectors and connecting parts, which is applied in the direction of conductive connection, printed circuit manufacturing, and connection, and can solve problems such as unreliable welding effect, mismatching shape and size of insulating shell connector components and printed circuit boards, etc.
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example 1
[0086] Combining the descriptions of Figures 1 to 18, the insulating shells of the plug-type and socket-type connectors were actually prepared, and the joints were actually placed in the insulating shells according to the above description. These joints were copper-beryllium alloy products, and the thickness of the gold plating on the entire surface was 30 microns . The material of the insulating shell is DupontH6130 liquid crystal polyester. The length and width of the plug-in connector are 52.5mm (including the mounting bracket) and 42.36mm, respectively. The cross-section of the concave part on the outer bottom plate of the insulating shell of the plug-in and socket-type connectors is rectangular, the side lengths are 0.62mm and 0.4mm respectively, and the depth of the joint entering the concave part is about 2mm. Determined proportionally. The recesses on the outer base plates of the pin and socket connectors are filled with Cleanline LR725 non-cleaning solder paste, now...
example 2
[0088] Another set of pin and socket connectors was prepared in substantially the same manner as described in Example 1, and solder balls were placed into the recesses of the outer base plate. After several hours of processing in the flux reflow furnace described in Example 1, due to changes in natural environmental conditions, another set of plug and socket connectors that are basically the same as those described in Example 1 will be processed as described in Example 1. Describe the same reflow heating process. The conditions of the remelting furnace are shown in Table 1. The maximum and minimum temperatures of the plug-in connector and the adjacent circuit board are shown in Table 2, and the maximum positive and negative temperature gradients are shown in Table 3. The cooling time is shown in Table 4, and the temperature at different times and moving distances is shown in Figure 26b. It can be seen from the curve of Fig. 26b that it differs from the curve of Fig. 26a, and...
example 3
[0098] Another set of connectors was prepared using the same conditions as in Examples 1 and 2, but due to different natural environmental conditions, it was different from the specific curves shown in Figure 26a and Figure 26b. After the connector was fabricated, the solder balls at six positions on the pin connector's outer backplane were inspected using an existing point-distance laser sensor from Cyber Optics in Minneapolis, Minnesota. Figure 9 The 6 positions are shown in , namely 27a and 27b for laser irradiation from L1 direction, 27c and 27d for laser irradiation from L2 direction, and 27e and 27f for laser irradiation from L3 direction. At each position, a laser beam can illuminate 5 solder balls at the same time. Figures 27a-27f show the patterns of these laser irradiations. Table 3 shows the height of the highest point of each solder ball relative to the plane of the outer bottom plate of the pin connector. The sorting of the solder ball positions of each group ...
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Abstract
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