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Positive film type light sensitiveness anticorrosion additive compsn. and application thereof

A photosensitive and resist technology, applied in optics, opto-mechanical equipment, instruments, etc., can solve the problems of difficult use and high price of printed circuit substrates

Inactive Publication Date: 2005-06-22
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] As a photoacid generator for a positive photosensitive resist material, for example, NAI-105 or PAI-101 manufactured by Midori Chemical Co., Ltd. can be used, and its price is as high as 20,000 yen / g. It is also necessary to mix 1 to 5 parts by mass ( / 100 parts by mass of solid content), and only the photoacid generator component in the resist material is as high as about 100,000 to 500,000 yen / kg. Difficult to use for circuit board applications

Method used

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  • Positive film type light sensitiveness anticorrosion additive compsn. and application thereof
  • Positive film type light sensitiveness anticorrosion additive compsn. and application thereof
  • Positive film type light sensitiveness anticorrosion additive compsn. and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0164] 200 ml of tetrahydrofuran was charged into a 4-neck flask with an inner volume of 1000 ml, equipped with a stirrer, a thermometer, a cooling tube and a dropping funnel with an inner volume of 500 ml, and the external temperature was raised to 80° C. under reflux in a water bath while stirring. In addition, 100 grams (0.75 moles) of 4-(1-methylvinyl) phenol (hereinafter referred to as PIPE) purified by crystallization and purification of 2-octanol solution, 100 grams (0.75 moles) of methyl acrylate purified by distillation were placed in a 1000 ml Erlenmeyer flask. 193.7 g (2.25 mol) of ester, 108 g (0.75 mol) of 1-ethoxyethyl acrylate, 16.4 g (0.10 mol) of azobisisobutyronitrile as a radical polymerization initiator, and 200 ml of tetrahydrofuran as a solvent.

[0165] After the solution was stirred and dissolved, the whole amount was transferred to the dropping funnel twice, and dropped into the above-mentioned 4-neck flask at a speed of about a continuous reflux state....

Embodiment 2~4

[0174] The methyl acrylate used in Example 1 was changed as shown in Table 1, and other conditions were completely the same as in Example 1, and the reaction and post-treatment were performed. The molar ratio, yield, weight average molecular weight, and molecular weight dispersion of the obtained copolymer were measured in the same manner as in Example 1. Moreover, solvent solubility, the dissolution rate with respect to alkaline developing solution, transparency, and thermal stability were evaluated similarly to Example 1. These analysis results and evaluation results are shown in Table 1 together with the results of Example 1.

Embodiment 5~6

[0180] Except for replacing the 1-ethoxyethyl acrylate used in Example 1 with the alkoxyalkyl acrylates shown in Table 2 at the molar ratios shown in Table 2, the reaction was carried out in the same manner as in Example 1. Post-processing, analysis and evaluation. The analysis results and evaluation results of the obtained copolymer are shown in Table 2 together with the results of Example 1.

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Abstract

A photo-acid generating agent having at least one dichloro acetyl group suitable as a positive type photosensitivity resist composition is offered, and the new positive type photosensitivity resist composition which used the new acid sensitivity copolymer and the aforementioned photo-acid generating agent as the essential component is further offered.

Description

technical field [0001] The present invention provides a cheap photoacid generator suitable as a positive photoresist material, and in the positive photoresist material, it provides a combination of a novel acid-sensitive copolymer and the above-mentioned A new positive photoresist material with an acid generator as an essential component. Background technique [0002] At present, when manufacturing printed circuit boards and the like, a photoresist is applied to the substrate, a mask is attached, and near-ultraviolet light is irradiated, followed by etching, and wiring is drawn on the substrate. [0003] As a photoresist material used in the manufacture of printed circuits, a negative type photosensitive resist material is mainly used at present, which is generally a composition composed of a polycarboxylic acid resin, an ethylenically unsaturated compound, and a photopolymerization initiator. Apply this composition on a substrate, apply a mask to irradiate ultraviolet ligh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/039C07C22/00G03F7/00
CPCG03F7/0045G03F7/0388G03F7/0392G03F7/0397G03F7/0758
Inventor 田原修二柴原立子森田守次山本喜博小野一良
Owner MITSUI CHEM INC