Printed circuit board and its making process
A technology of printed circuit boards and conductive pathways, which is applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., and can solve the problems of not being able to obtain fine-pitch graphics and increasing manufacturing steps
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no. 1 example
[0021] 1A to 1G are schematic diagrams showing steps of manufacturing a printed circuit board according to a first embodiment of the present invention.
[0022] Reference numeral 1 denotes an insulating substrate, reference numeral 1B denotes a conductive circuit, reference numeral 1C denotes a penetrating hole (through hole), reference numeral 1D denotes a dry film resist, reference numeral 1E denotes a plating layer, and reference numeral 1F denotes an insulating material.
[0023] As shown in FIG. 1A, an insulating substrate 1 is first prepared. For example, using glass cloth epoxy resin, glass cloth bismaleimide triazin resin (bismaleimide triazin resin), glass cloth polymerized (phenylene ether) resin, or polyimide-aromatic A polyimide-aramid liquid crystal polymer forms the insulating substrate 1 . For example, the insulating substrate 1 is prepared by forming a thermosetting epoxy resin to a thickness of about 50 µm. On this insulating substrate 1, through-holes 1C ar...
no. 2 example
[0032] 2A to 2G are schematic diagrams showing steps of manufacturing a printed circuit board according to a second embodiment of the present invention. The steps of the second embodiment shown in Figures 2A, 2B, 2C, 2D, 2E, 2F and 2G correspond to the first embodiment shown in Figures 1A, 1B, 1C, 1D, 1E, 1F and 1G respectively each step. The points in which the second embodiment differs from the first embodiment will be mainly described below.
[0033] First, an insulating substrate 1 shown in Fig. 2A is prepared. This insulating substrate 1 has a three-layer structure in which a second insulating substrate 12 is provided on the front side of the first insulating substrate 11, and a third insulating substrate 13 is provided on the back side thereof. Using materials selected from those described in the first embodiment, first insulating substrate 11 , second insulating substrate 12 , and third insulating substrate 13 are formed. In particular, first insulating substrate 11 ...
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Abstract
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