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Electrostatic adsorption table and substrate processing apparatus

一种静电吸附、基底的技术，应用在应用静电吸引力的保持装置、定位装置、电路等方向，能够解决固定基底变形或移位等问题

Inactive Publication Date: 2006-04-26
ANELVA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If heat exchange or thermal expansion of the ESC table occurs due to a rise in substrate temperature, the fixed substrate may be deformed or displaced

Method used

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  • Electrostatic adsorption table and substrate processing apparatus
  • Electrostatic adsorption table and substrate processing apparatus
  • Electrostatic adsorption table and substrate processing apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] Preferred embodiments of the present invention will be described below. First, the ESC stage of the embodiment will be described. figure 1 is a schematic front cross-sectional view of the ESC stage of this embodiment. The ESC stage includes a main body 41, a dielectric plate 42 on which the object 9 is clamped, and a suction electrode 43 to which a voltage for suction is applied.

[0012] The ESC table has a table shape as a whole, and a disk-shaped object 9 is fixed to the upper surface of the ESC table. The main body 41 is made of metal such as aluminum or stainless steel. The main body 41 forms a low cylindrical shape. The adsorption electrode 43 is fixed to the main body 41 . like figure 1 As shown, the adsorption electrode 43 has a flange-shaped portion 431 at the bottom thereof. This portion 431 is hereinafter referred to as "electrode flange". The adsorption electrode 43 is fixed to the main body 41 by bolting on the electrode flange. The suction electrod...

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PUM

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Abstract

The present application discloses the structure of an ESC stage in which an adsorbed electrode is sandwiched between a deceleration buffer layer and a cladding layer. The thermal expansion coefficient of the deceleration buffer layer and the cladding is located between the dielectric plate and the adsorption electrode. The application also discloses the optimum overall thickness of the ESC table, the optimum ratio of the mixture constituting the deceleration bumper, the optimum range of the coefficient of thermal expansion of the mixture. The present application further discloses a substrate processing device for processing on a substrate, keeping the temperature of the substrate higher than room temperature, and the device includes an electrostatic adsorption table for fixing the substrate during the processing.

Description

technical field [0001] The present invention relates to an electrostatic chucking stage for fixing a plate-like object such as a substrate, and to a substrate processing apparatus including an ESC stage. Background technique [0002] ESC tables that use electrostatic force to attract substrates are widely used in the field of substrate processing. In the production of electronic devices such as LSIs (Large Scale Integrations) and display devices such as LCDs (Liquid Crystal Displays), for example, there are many steps for processing substrates that are the basis of products. During these steps, the ESC station is used to ensure process uniformity and process reproducibility. Taking plasma etching as an example, a substrate is etched using the function of ions and activated particles generated in the plasma. Here, the ESC stage is used to hold the substrate in an optimal position relative to the plasma. [0003] In general, an ESC stage includes a suction electrode to whic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23Q3/15H02N13/00H01L21/68B23B5/34B23Q3/154H01L21/00H01L21/683
CPCB23Q3/154H01J37/32082H01L21/67103H01L21/6831Y10T279/23
Inventor 佐护康实金子一秋冈田拓士池田真义
Owner ANELVA CORP