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Process for the manufacture of CPU heat pipe radiator

A technology of heat pipe radiator and process steps, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of small radiator space and high noise, and achieve small volume, low noise and high efficiency Effect

Inactive Publication Date: 2006-04-26
HOHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This produces the following two problems: (1) the higher the speed of the fan, the greater the noise it produces; (2) the increase in the degree of integration of computer electronic components makes the size of the motherboard and the chassis smaller and smaller , so the space left for the heat sink is getting smaller and smaller

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Embodiment 1, connect 36 square metal sheets around the surface of a cylinder with a diameter of 10mm in a sunflower shape to form a cylindrical body, the length of the body is 50mm, the linear distance between the metal sheet and the body is 15mm, and the angle between the metal sheets is 10°, the cylindrical body is connected to the base, and the vertical distance between the base and the metal sheet is 2mm. Bore a blind hole on one end of the cylinder, the distance from the bottom of the hole to the base is 2mm. Coat metal adhesive (Loctite glue) on the inner wall of the mouth 2mm away from the top plane of the mouth, then put a mesh liquid-absorbing core from the mouth, and then inject heat transfer media such as water, methanol, and ethanol. Vacuum at an ambient temperature of 100°C, and press in with a metal cap coated with the same adhesive with a thickness of about 3mm. After the preparation is completed, a 2000 rpm low-speed fan is connected to the opposite en...

Embodiment 2

[0012] Connect 72 square metal sheets around the surface of a cylinder with a diameter of 30mm in the shape of a sun flower to form a cylindrical body. The length of the body is 100mm, the linear distance between the metal sheet and the body is 30mm, and the angle between the metal sheets is 5°. The shape is connected to the base, and the vertical distance between the base and the metal sheet is 10mm. Bore a blind hole on one end of the cylinder, the distance from the bottom of the hole to the base is 6mm. Coat metal adhesive (Loctite glue) on the inner wall of the mouth 5mm away from the top plane of the mouth, then put a mesh liquid-absorbing core from the mouth, and then inject heat transfer media such as water, methanol, and ethanol. Vacuum at an ambient temperature of 400°C, and press in with a metal cap coated with the same adhesive with a thickness of about 3mm. After the preparation is completed, a 3000 rpm low-speed fan is connected to the opposite end cover of the b...

Embodiment 3

[0014] Connect 180 square metal sheets around the surface of a cylinder with a diameter of 15mm in the shape of a sun flower to form a cylindrical body. The length of the body is 75mm, the linear distance between the metal sheet and the body is 24mm, and the angle between the metal sheets is 2°. The body is connected to the base, and the vertical distance between the base and the metal sheet is 6mm. Bore a blind hole on one end of the cylinder, the distance from the bottom of the hole to the base is 4mm. Coat the metal adhesive (Loctite glue) on the inner wall of the mouth at a distance of 3 mm from the top plane of the mouth, then put a mesh liquid-absorbing core into the mouth, and then inject heat transfer media such as water, methanol, and ethanol. Vacuum at an ambient temperature of 250°C, and press in with a metal cap coated with the same adhesive with a thickness of about 3mm. After the preparation is completed, a 2500 rpm low-speed fan is connected to the opposite end...

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Abstract

The invention relates to a method for preparing a CPU heat pipe radiator. The process is to connect 36 to 180 square metal sheets around the surface of a cylinder with a diameter of 10 to 30 mm in the shape of a sunflower to form a cylindrical body. The length of the body is 50-100mm, the linear distance between the metal sheet and the body is 15-30mm, the angle between the metal sheets is 10-2°, the cylindrical body is connected to the base, and the vertical distance between the base and the metal sheet is 2-10mm. Bore a blind hole on one end of the cylinder, the distance from the bottom of the hole to the base is 2-6mm. Coat the inner wall of the port with a distance of 2 to 5 mm from the top plane of the port, and then put a mesh liquid-absorbing core into the port, and then inject heat transfer media such as water, methanol, and ethanol, at an ambient temperature of 100 Vacuum at ~400°C, and press in with a metal cap coated with the same adhesive with a thickness of about 3mm. After the preparation is completed, a 2000-3000 rpm low-speed fan is connected to the opposite end cover of the base. Advantages: high efficiency, low noise, small size, low cost, beautiful appearance, etc.

Description

technical field [0001] The invention relates to a preparation method of a CPU heat pipe radiator, which is used for heat dissipation of a computer CPU and belongs to the technical field of computer auxiliary equipment. Background technique [0002] With the improvement of the integration of computer electronic components, the CPU operation speed is getting faster and faster, and the heat generated by it is also increasing. Working normally within a certain temperature range has become an important restrictive factor for the development of computers to high frequencies. The conventional solution is to superimpose and connect the CPU and the formed aluminum heat sink on the heat dissipation base, and add a 3000-6000 rpm fan to dissipate the heat on the formed aluminum. Its manufacturing method is to adopt aluminum alloy one-time die-casting molding. The metal aluminum sheets are generally in a parallel state with an interval of 0.5-4mm. The downside is that the more heat th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
Inventor 李支东
Owner HOHAI UNIV
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