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System and method for rebuilding lighting condition on welder of integrated circuit

A lighting condition, welding machine technology, applied in the direction of circuits, welding equipment, electrical components, etc., can solve the problem of spending a lot of time calibrating and regenerating

Inactive Publication Date: 2006-07-05
TEXAS INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] * Time consumption to perform calibration regeneration: When components are soldered, operators need to spend a lot of time performing calibration regeneration

Method used

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  • System and method for rebuilding lighting condition on welder of integrated circuit
  • System and method for rebuilding lighting condition on welder of integrated circuit
  • System and method for rebuilding lighting condition on welder of integrated circuit

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Experimental program
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Effect test

Embodiment Construction

[0043] In current semiconductor assembly technology, large changes in lighting settings can cause changes in the images seen by the optics and cameras connected to the computerized welding machines ("bonders"), and these changes will affect pattern recognition The system accurately locates the position of the starting point and the position of the pad.

[0044] According to the invention, the calibration reference is digitally stored in the component program together with the location coordinates of the positioning start position during the "main teaching" time. These stored images can be shared among multiple welding machines as part of a component program. When a large number of devices need to be soldered. The component program is loaded into the machine and a pattern recognition system is used to automatically find matching references. At the same time, the quality of the latest captured image is compared with the stored image. The stored images are considered to be of ...

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PUM

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Abstract

A computerized system and method for recreating illumination conditions in a slave bonder, prepared to attach connecting bonds onto bond pads of a slave integrated circuit. First, images of illuminated alignment references of a master circuit on a master bonder are defined; these data are analyzed to construct relationships between reference images and bond locations; data and relationships are stored in a master file. Secondly, on a slave bonder, the master reference image data are regenerated so that the illumination conditions of the slave bonder, as based on images, are recreated. Thirdly, images of the slave circuit references are produced under the newly created illumination conditions, and the alignment references are compensated. Finally, the bonding locations of the slave circuit and the bonding program of the slave bonder are corrected so that connecting bonds can be attached onto the recomputed correct bond locations.

Description

technical field [0001] This invention relates generally to semiconductor components and electronic systems, and more particularly to error reduction devices and the operation of computer-controlled welding machines for the assembly of integrated circuits. Background technique [0002] In an integrated circuit (IC) assembly, an IC chip is typically mounted on a lead frame and electrically connected to the lead frame through wire segments. Typically, the assembled chips are packaged into a protective enclosure (eg, a ceramic package, or a plastic package using a molding process). In particular, an IC chip has many pads, which are generally located around the chip; these pads have a predetermined bonding area and pitch (pad pitch). A lead frame typically has a number of thin "inner" wires connected to the lead segments and contained within the enclosure, and a number of wider "outer" wires connected to other parts such as solder to the circuit board. [0003] The metal wire s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K20/10H01L21/60G06F17/00H01L21/68
CPCH01L21/681G06F8/00G06F17/00H01L23/48H01L21/60
Inventor S·K·科杜里D·J·博恩
Owner TEXAS INSTR INC