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Package seal composition for electronic device

A composition and mixture technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problem of high viscosity

Inactive Publication Date: 2006-07-19
HENKEL IP & HOLDING GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these materials have the disadvantage for the production process that they are highly viscous or even exist in the form of a solid film

Method used

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  • Package seal composition for electronic device
  • Package seal composition for electronic device
  • Package seal composition for electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0106] Preparation of benzamido-terminated dimer diamine bismaleimide

[0107]

[0108] In a 500 ml three-necked flask equipped with an addition funnel, magnetic stirrer, internal temperature probe and nitrogen input / output ports, diamine dimer (Versamine 552 sold by Henkel, 20.0 g, 37 mmol) was dissolved in Et 2 O (200ml). With vigorous stirring, NaOH was added aq (11.7 ml of 6.25M solution, dissolved in 100 ml of H 2 O dilution, 73 mmol). The solution was placed under a steady flow of nitrogen and cooled to 3°C with stirring on an ice bath. Add diethyl ether (Et 2 O) A solution (50 mL) of p-nitrobenzoyl chloride (13.6 g, 73 mmol) was added to the reaction over a period of 60 minutes, maintaining internal T aq (300ml), NaCl aq (250 mL) and distilled water (2 x 250 mL) to wash the isolated organic layer. Separate the organic phase with anhydrous MgSO 4 Drying, filtration and vacuum removal of the solvent gave a dinitro compound as a viscous yellow oil with...

Embodiment 2

[0112] Preparation of 20-bismaleimido-10,11

[0113] - Dioctyl-eicosane (and isomers)

[0114]

[0115] Maleic anhydride (98.06 g, 1.02 eq., NH 2 ) was dissolved in 500 ml tetrahydrofuran (THF). Start stirring and freeze the solution with a dry ice / water bath. Slow addition of 250 mL THF in dimerdiamine (Versamine 552, Henkel, 245.03 g, 0.4477 mmol) was started. Add within 1 hour. After the addition was complete, the ice bath was removed and the slow addition funnel was rinsed thoroughly with 375 mL of THF to incorporate into the solid diamine. After 1 hour, an ice bath was placed around the flask. 1-Hydroxybenzotriazole (96.79 g, 0.80 equivalents, as-NH 2 meter) was rinsed into the flask with 50 ml of THF. When the temperature reaches 5°C, start to slowly add dicyclohexylcarbodiimide (DCC) (188.43 g, 1.02 equiv. in -HN 2 count). During the addition, the temperature was kept below 10°C. After the addition of DCC was complete, the slow additio...

Embodiment 3

[0121] Preparation of butadiene-acrylonitrile bismaleimide

[0122]

[0123] In a 3-liter four-necked flask equipped with a funnel, mechanical stirrer, internal temperature probe, and nitrogen input / output ports, amino-terminated butadiene acrylonitrile (sold by BF Goodrich under the trade name Hycar resin 1300×42ATBN, where m and n in the structure are integers such that the number average molecular weight is 3600) (450 g, 500 mmol, based on amine equivalent weight AEW=450 g) dissolved in CHCl 3 (1000 ml). The stirred solution was placed under nitrogen and cooled on an ice bath. Add CHCl to the addition funnel 3 (50 mL) of maleic anhydride (98.1 g, 1 mol) and this solution was added to the reaction over 30 minutes, keeping the internal reaction temperature below 10°C. The mixture was stirred on an ice bath for 30 minutes, then allowed to warm to room temperature and stirred for an additional 4 hours. Acetic anhydride (Ac 2 O) (653.4 grams, 6 moles), triet...

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Abstract

A curable composition for encapsulating an electronic component comprises one or more mono- or polyfunctional maleimide compounds, or one or more mono- or polyfunctional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, with a free radical curing agent, and optionally, one or more fillers.

Description

[0001] This application is a divisional application entitled "Encapsulation and Sealing Composition for Electronic Devices" with application number 99119202.8 filed on June 30, 1999. technical field [0002] This invention relates to encapsulant compositions for electronic devices to protect electronic components and metallization of electronic components from environmental corrosion and mechanical damage. Background technique [0003] Microelectronic devices include myriads of circuit elements, primarily transistors, but also resistors, capacitors, and other components, mounted on integrated circuit (IC) chips. An integrated circuit element may comprise a single bare chip, a single packaged chip, or a single or multiple chips in a hermetic package. These electronic components are interconnected to form circuits which are eventually interconnected and supported on a carrier or substrate, such as a printed wiring board. [0004] Various materials used to make integrated circ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F290/00C08F22/40H01L23/29C08F2/48C08F290/06C08F299/02C08G18/28C08G18/73C08L101/00H01L23/31
CPCC08F290/065H01L23/293H01L2924/0002C08G18/73C08F290/06C08G18/285H01L2924/00B01D35/00B01D2201/31
Inventor B·马Q·K·童
Owner HENKEL IP & HOLDING GMBH