Glassware forming die and manufacturing process thereof

Abstract

During the preparation of the molten material and the casting of the mold body, the thermal conductivity of the nickel resist ductile iron glassware forming blank mold and blow mold is selectively controlled by the formation of dense graphite in the microstructure of the mold. In particular, for nickel-resistant ductile iron of type D5 according to ASTM-A439-84, by reducing the magnesium and sulfur content of the cast iron component to the range of 0.01 to 0.04 wt. % magnesium and 0.00 to 0.01 wt. % sulfur, Simultaneously adding 0.10 to 0.25% by weight of titanium to the cast iron component selectively forms dense graphite in the casting microstructure of the mold body. Whereas the formation of dense graphite in cast ductile iron microstructures is generally considered unsuitable for forming molds for glass containers, it has been found that small but measurable graphite formation presents an opportunity to selectively modify the thermal conductivity properties of the mold body.

Description

technical field [0001] The present invention relates to glassware forming machinery, and more particularly to a glassware forming mold and method of manufacture in which the microstructure of the mold material is manipulated to achieve desired heat transfer characteristics. Background technique [0002] Recently the glass container processing industry uses so-called line-of-line bottle machines. Such machinery includes a number of discrete or independent manufacturing units, each of which has various operating mechanisms for converting incoming or molten glass gobs into hollow glass containers while conveying the glass containers through successive sections of the machinery unit. Each mechanical unit generally includes one or more blank molds in which a glass blank is initially formed by a blowing or pressurizing operation, and one or more turning arms for delivering the blank to the blow molds in which the container Blow molding to final form, grippers to move the formed c...

AI Technical Summary

Problems solved by technology

Increased silicon content reduces thermal conductivity of the mold material