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Analysis methd of power supply random signal and its reducing method

An analysis method and noise technology, applied in circuits, electrical components, electro-solid devices, etc., can solve the problems of power supply noise of semiconductor components, polluted circuit operation signals and power supply, and large voltage drop.

Inactive Publication Date: 2007-01-10
SILICON INTEGRATED SYSTEMS
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Problems solved by technology

With the increase of operating frequency, transmission speed and density of electronic circuits, the noise is also greatly increased, which seriously affects the normal operation of the system and causes malfunctions
[0007] In view of the above-mentioned background of the invention, with the progress of semiconductor manufacturing technology and integrated circuit design, the operating frequency of integrated circuits is getting higher and higher, and the area of ​​chips is also getting larger and larger at the same time. The resulting voltage drop is getting bigger and bigger. At the same time, the high operating frequency of semiconductor components also causes serious power noise, which interferes and pollutes normal circuit operation signals and power supply, and affects the operating performance of integrated circuits and the correctness of signal processing.

Method used

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  • Analysis methd of power supply random signal and its reducing method
  • Analysis methd of power supply random signal and its reducing method
  • Analysis methd of power supply random signal and its reducing method

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Embodiment Construction

[0037] Please refer to figure 1 , which is a schematic diagram of the processing flow of an embodiment of the present invention. Such as figure 1 As shown, in order to obtain the power supply network model of the integrated circuit design first, in the power supply network analysis 30 of the processing flow 10, the relevant design reference materials 20 of the integrated circuit design are first input, and the chip power supply analysis is performed by using computer-aided design software ( Chip Power Analysis), in order to obtain the power network model of the integrated circuit design, according to the power network model of the integrated circuit design, the characteristic parameters and data of the DC power network model and the AC power network model of the integrated circuit design can be obtained, among which Reference materials for integrated circuit design generally include: standard component database, power network impedance, operating frequency, operating temperat...

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Abstract

The present invention relates to a method for analyzing and reducing power supply noise in the designing process of integrated circuit. Firstly, it utilizes computer-aided design software to analyze the related material of integrated circuit design and obtain the power supply network model of integrated circuit design, then defines that the power supply network model is formed from mutually-connected several unit blocks. After the related material is analyzed, the number of elements and their type parameters of electrically-connecting to all the unit blocks can be known, and can be used as element reference material of power supply network model unit block, then the equivalent circuit formed from elements electrically-connected to unit block can be used to calculate the voltage drop due to operation of every unit block.

Description

technical field [0001] The present invention relates to integrated circuit technology, and relates to an analysis method and reduction method of power noise (Power Noise), in particular to an analysis and reduction method of power noise applied in the process of integrated circuit design. Capacitors are arranged in the integrated circuit to reduce power noise in the integrated circuit. Background technique [0002] With the development of semiconductor manufacturing technology and integrated circuit design, various integrated circuits with different functions are widely used in many electronic products. At the same time, the line size of semiconductor components has entered sub-micron (Sub-Micro) or even deep sub-micron (Deep Sub-Micro) field, and the integration level of integrated circuits is also increasing rapidly. Since the surface of the semiconductor structure cannot provide enough area to make the interconnection (Interconnection) required by the semiconductor eleme...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/82H01L27/00G06F17/50
Inventor 田浩伦陈尚义吕明园涂俊安
Owner SILICON INTEGRATED SYSTEMS