Check patentability & draft patents in minutes with Patsnap Eureka AI!

Semiconductor memory device

A storage device and semiconductor technology, applied in static memory, digital memory information, information storage, etc., can solve problems such as increased cost, increased circuit area, and increased circuit area.

Inactive Publication Date: 2007-08-01
PANASONIC SEMICON SOLUTIONS CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the existing voltage generation circuit using the charge pump method, in order to increase the current capacity, the capacitor circuit can be increased or the capacitor conversion cycle can be shortened, but increasing the capacitor will bring about increased circuit area and increased cost. question
In addition, shortening the conversion cycle requires a high-power drive circuit, which increases the circuit area and increases the current consumption.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor memory device
  • Semiconductor memory device
  • Semiconductor memory device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0038] FIG. 1 is a circuit diagram showing the structure of a memory cell in a semiconductor memory device according to a first embodiment of the present invention. In FIG. 1, 100 is a memory cell, WL is a word line, BL is a bit line, 101 is an access transistor, 102 is a capacitor (capacitive element), and VCP is a cell anode power supply. Such a structure is the same as the existing example. The access transistor 101 is composed of a P-channel transistor. As the gate oxide film of the access transistor 101, a thin (1.9 nm to 3.0 nm) oxide film is used. In addition, the capacitor 102 may be a structure in which an insulating film is sandwiched between semiconductors, or a gate capacitor of a MOS transistor may be used. At this time, in order to suppress leakage current through the gate, a slightly thick film (2.4 nm to 5.0 nm) is used as the gate oxide film of the MOS transistor. When leakage current does not pose a problem, the same film thickness as the gate oxide film o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a semiconductor memory device whose circuit area is comparatively small and that improves holding characteristics of data in a memory cell. In a word line voltage generator, a voltage Vdd3 of a second power source that is higher than a voltage Vdd of a first power source supplied to the memory cell is applied to a first operational amplifier circuit and a reference voltage generating circuit, and the reference voltage generating circuit generates a voltage that is higher, by a voltage generated through a diode connection of a p-channel transistor, than the voltage proportional to the voltage Vdd as a first reference voltage Vref, and the first operational amplifier circuit outputs a voltage equal to the first reference voltage Vref as a word line drive voltage Vwl. Thus, a leakage current when the memory cell is off can be reduced, without requiring a charge pump circuit or the like.

Description

technical field [0001] The present invention relates to a semiconductor memory device, in particular to a DRAM (Dynamic Random Access Memory) type semiconductor memory device capable of improving data retention characteristics. In addition, the present invention particularly relates to a semiconductor memory device most suitable for mixed mounting with a logic circuit. Background technique [0002] FIG. 14 is a circuit diagram showing the structure of a memory cell of a conventional DRAM (Dynamic Random Access Memory). 100 is a memory cell, WL is a word line, BL is a bit line, 101 is an access transistor, 102 is a capacitor, and VCP is a cell plate power supply. The memory cell 100 is composed of an access transistor 101 and a capacitor 102 . In addition, the drain of the access transistor 101 is connected to one end of the capacitor 102 , the gate is connected to the word line WL, the source is connected to the bit line BL, and the other end of the capacitor 102 is connec...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G11C11/401G11C11/4074G05F3/24G11C7/06G11C11/407G11C11/408G11C11/4091G11C11/4099
CPCG11C11/4085G11C11/4091G11C11/4099G11C7/06G11C11/4074
Inventor 折笠宪一
Owner PANASONIC SEMICON SOLUTIONS CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More