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Refrigerating cooler of semiconductor element or device

A cooling device and semiconductor technology, which is applied to semiconductor devices, semiconductor/solid-state device components, cooling fluid circulation devices, etc., can solve the problems of inability to reuse cooling devices and poor compatibility.

Inactive Publication Date: 2002-07-03
LG ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] Since the evaporator 21 is directly connected to the semiconductor components, the existing cooling device cannot be reused when the semiconductor components are upgraded, thereby degrading its compatibility

Method used

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  • Refrigerating cooler of semiconductor element or device
  • Refrigerating cooler of semiconductor element or device
  • Refrigerating cooler of semiconductor element or device

Examples

Experimental program
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Embodiment Construction

[0028] Preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. In the following description, the same reference numerals are used to identify the same elements in different drawings. The matters defined in the present invention, such as the detailed structure and elements of the device, are only used to help comprehensive understanding of the present invention. Therefore, it is apparent that the present invention may be practiced without departing from these limitations. Also, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

[0029] A preferred embodiment of the present invention refrigeration cooling device 3, such as image 3 Shown is an evaporator 31, a compressor 32, a condenser 33, an expansion valve 34, a housing 35 enclosing the semiconductor component 10 and the evaporator 31 mounted on a printed circuit board (PCB) 20 of the uppe...

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PUM

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Abstract

The present invention relates to a refrigerated cooling apparatus for cooling heat generated from a semiconductor device by forming a circulating flow path of the air in a case with an evaporator and the semiconductor mounted.The refrigerated cooling apparatus includes a compressor for compressing a coolant at high pressure, a condenser, connected to the compressor, for condensing the coolant, an expansion valve connected to the condenser, an evaporator, connected to the expansion valve and the compressor, for evaporating the coolant, and a venting fan mounted on the evaporator, wherein the evaporator is integrally installed to the case forming a cooling space for a semiconductor device, and is connected to the compressor and the expansion valve provided on an exterior of the case through a connecting pipe; the venting fan is mounted on the evaporator to be divided from the semiconductor device; and a circulating flow path is formed in the case, so that a heat-transferred air of a low temperature absorbs a heat from the semiconductor device and flows to the evaporator.

Description

technical field [0001] The invention relates to a cooling device for semiconductor components, especially a refrigeration and cooling device for semiconductor components, which can use air heat transfer in an evaporator to cool the heat of semiconductor components, and can be applied to other various semiconductor components. components. Background technique [0002] In common semiconductor components including crystal diode rectifiers (SCRs), TRIACs, etc., the increase in integration and the improvement in the performance of high-speed data processing have led to an increase in heat generation density. [0003] Increases in the temperature of semiconductor components are the cause of problems such as interface peeling due to differences in thermal expansion due to thermal stress at the junction of semiconductor components; reduction in signal processing speed; or other problems such as component failure. [0004] In order to solve the above-mention...

Claims

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Application Information

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IPC IPC(8): F24F1/00F24F13/02F24F13/22F25D17/06F25D19/00G06F1/20H01L23/467
CPCH01L2924/0002F25D19/00H01L23/467G06F1/20F25D17/06H01L2924/00
Inventor 吴世基长东延吴世允李旭镛
Owner LG ELECTRONICS INC
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