Unlock instant, AI-driven research and patent intelligence for your innovation.

Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof

A technology of high-energy rays and circuit substrates, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, printed circuits, conductive patterns, etc., can solve problems such as difficulties, temperature rise, and viscosity reduction

Inactive Publication Date: 2003-03-19
TOYO INK SC HOLD CO LTD +1
View PDF2 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can reduce the heating temperature to reduce the impact on the substrate, it is difficult to form fine patterns because the paste increases the temperature of the unhardened coating and reduces the viscosity. Improved adhesion

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof
  • Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof
  • Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0094] Embodiment 1~4, comparative example 1~2

[0095] (1) Modulation method of conductive paste

[0096] The components shown in Table 1 were pre-mixed with a puppet machine, and then kneaded with 3 rolls to prepare a conductive paste.

[0097] (2) Manufacturing method of conductor circuit

[0098] On a previously corona-treated PET substrate, a circuit pattern was formed from a 200-mesh stainless steel screen using a conductive paste. Next, electron beams were irradiated with an area electron beam type electron beam irradiation device [Curetron EBC-200-20-30] (manufactured by Nisshin Hibolte-ji Co., Ltd.) under the conditions of an accelerating voltage of 175 kV and an irradiation dose of 40 KGy to obtain a conductor circuit. .

Embodiment 5

[0104] After preparing a conductive paste in the same manner as in Example 1 and forming a circuit pattern on a substrate, electron beams were irradiated under the same conditions as in Example 1. Further, heating and pressing roll treatment was performed under conditions of a temperature of 100° C. and a pressure of 10 kgf / cm to obtain a conductor circuit.

Embodiment 6

[0106] Except that the heat and pressure treatment temperature was replaced by 25° C., the rest was the same as in Example 5 to obtain a conductor circuit.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
heat deflection temperatureaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
Login to View More

Abstract

There are disclosed; an active energy beam curing type conductive paste, containing a conductive substance, and an active energy beam polymerizable compound, wherein a cured matter, obtained when a composition of the paste excluding the conductive substance is cured with an electron beam having an acceleration voltage of 150 kV and an irradiated dose of 40 kGy, has an internal stress of 5 to 50 Mpa; a production method and a device for a conductor circuit substrate using the active energy beam curing type conductive paste; and a non-contact ID using the active energy beam curing type conductive paste and a production method for the ID.

Description

technical field [0001] The present invention relates to an activated high-energy ray beam hardening type conductive paste and a method for producing a conductive circuit substrate using the same. The present invention also relates to a method and device for manufacturing a conductive circuit substrate that can be preferably used as a non-contact ID antenna, and a non-contact ID and a method for manufacturing the same. Background technique [0002] In recent years, the demand for non-contact IC cards and non-contact IC tags (hereinafter referred to as "non-contact ID") has been increasing for telephone cards, commuter passes, and other applications. In the contactless ID, radio waves are used to transmit and receive data such as the balance of telephone charges and the expiration date of commuter coupons, and the power necessary for this communication is also generated by radio waves from the outside. [0003] As one method of manufacturing a circuit (commonly called an ante...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08F2/46G06K19/077H05K1/09
CPCG06K19/07749G06K19/07779G06K19/0775G06K19/07783H05K1/095Y10T428/24835H01B1/20
Inventor 鹤田洋明中村稔秋田雅典伊藤釭司森俊裕
Owner TOYO INK SC HOLD CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com