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Deposit film and its producing method

A thin film and deposition layer technology, applied in the field of aluminum oxide deposition film, can solve the problems such as the inability to obtain the aluminum oxide deposition film and the difficulty in measuring the amount of oxygen

Inactive Publication Date: 2003-04-09
TOHCELLO CO LTD (JP)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to measure the amount of oxygen during deposition in a deposition setup
If the deposited layer is temporarily exposed to the atmosphere to measure the amount of oxygen, the deposited layer will react with the oxygen in the atmosphere to change the value of x, so like the above method, I am afraid that it will not be possible to obtain an oxidation with stable quality (such as gas barrier properties) Aluminum deposited film

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] On one surface of a biaxially oriented polyethylene terephthalate film (PET film) with a thickness of 12 microns as the base material, at an oxygen feed rate of 3.7 liters / minute (according to the base film width of 1 The electron beam heating method is used to thermally evaporate aluminum under the condition of 1 meter). Thus, an aluminum oxide deposited film having a light transmittance of 77% was prepared at a deposition rate of 600 m / min. Then, immediately after the deposition, on the surface of the deposition layer side of the obtained film, dry-laminate one layer of LLDPE (density: 0.920 g / cm) with a thickness of 50 micrometers. 3 , MFR: 3.8 g / 10 minutes) film, a double-layer film was prepared. The properties of the bilayer films are listed in Table 1.

Embodiment 2

[0092] On one surface of a biaxially oriented PET film with a thickness of 12 micrometers as a substrate, use an electron beam heating method under the condition that the oxygen feed rate is 3.4 liters / minute (according to the substrate film width is 1 meter). evaporated aluminum. Thus, an aluminum oxide deposited film having a light transmittance of 80% was prepared at a deposition rate of 600 m / min. Next, a double-layer film was prepared in the same manner as in Example 1. The properties of the bilayer films are listed in Table 1.

Embodiment 3

[0097] On one surface of a biaxially oriented PET film with a thickness of 12 micrometers as a substrate, the electron beam heating method is used under the condition that the oxygen feed rate is 4.6 liters / minute (according to the substrate film width is 1 meter). evaporated aluminum. Thus, an aluminum oxide deposited film having a light transmittance of 85% was produced at a deposition rate of 600 m / min.

[0098] Next, the deposited film wound on the roll is unwound in the atmosphere and rewound on another roll. The deposited film was left for 2 days. Then, a double-layer film was prepared in the same manner as in Example 1. The properties of the bilayer films are listed in Table 2.

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PUM

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Abstract

An aluminum oxide deposited film of the invention, comprising a substrate film and an aluminum oxide deposit layer of which the peel strength to the substrate film in a wet state is at least 0.3 N / 15mm, has an oxygen permeability of not more than 40 ml / m<2>.day.MPa and a water vapor permeability of not more than 4.0 g / m<2>.day. The deposition ratio (A / B) of a fluorescent X-ray intensity (A) kcps (aluminum K alpha -ray) of the aluminum oxide deposited film (1) to a fluorescent X-ray intensity (B) kcps (aluminum K alpha -ray) of an aluminum deposited film (2) obtained without feeding oxygen is (A / B) <= 0.85.

Description

technical field [0001] The invention relates to an aluminum oxide deposited film with excellent transparency and excellent barrier properties to gases (such as oxygen, water vapor) and a manufacturing method thereof. Background technique [0002] In recent years, transparent gas-barrier films formed by depositing inorganic oxides (such as silicon oxide or aluminum oxide) on the surface of plastic substrates by vacuum deposition, cathode sputtering, ion plating, chemical vapor deposition, etc. Materials with barrier properties to oxygen and water vapor have received great attention. [0003] In order to produce a gas barrier film having an aluminum oxide deposition layer, a method comprising the steps of passing oxygen to aluminum heated and evaporated using an electron beam or the like to oxidize the aluminum and depositing the aluminum oxide on a plastic substrate is generally employed. However, thermally evaporated aluminum reacts readily with oxygen. Therefore, if the o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/08
CPCC23C14/081C23C14/08
Inventor 三品纪年野本晃冈健司外山达也
Owner TOHCELLO CO LTD (JP)
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