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Thermal smelting adhesive based on polyamide block graft copolymer

A technology of hot-melt adhesives and polyamides, applied in the direction of grafted polymer adhesives, adhesive types, natural resin adhesives, etc., can solve the problems of shortened storage period, isocyanate toxicity, etc., and achieve high durability thermal effect

Inactive Publication Date: 2003-09-10
ATOFINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Admittedly, these adhesives have good heat resistance but it is necessary to wait until the crosslinking is complete, in addition, the use of isocyanates brings toxicity problems
Another disadvantage is the shelf life of these adhesives before application, which is greatly shortened if the composition is not protected from contact with moisture

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0097] Has a flexural modulus of 30 MPa, a weight average molecular weight Mn of 50000 g / mol, contains maleic anhydride copolymerized with 20 wt % ethyl acrylate and 3 wt % and has a melt flow index of 70 g / 10 min (at 2.16 kg / 190 °C) Ethylene terpolymers of (MFI) in a Leistritz® co-rotating twin-screw extruder with several mixing zones, with a temperature profile between 180° C. and 200° C., with Methods Synthesized monoamine-terminated poly(caprolactam-co-laurolactam) (coPA-6 / 12) with a molecular weight of 2950 g / mol. The terpolymer contained an average of 0.029 mol / 100 g of maleic anhydride. The 6 / 12 Single-NH 2 The copolyamide has a composition of 40 / 60 by weight and a melting point of 133°C. The enthalpy of fusion is 40 J / g. The ratio introduced into the extruder is such that the backbone polyolefin / amine terminated copolyamide ratio is 80 / 20 by weight.

[0098] The product thus produced was analyzed by transmission electron microscopy, revealing the polyamide phase by...

Embodiment 2

[0100] The terpolymer was the same as in Example 1. The copolyamide also uses one NH per chain 2 Functionally terminated, but involving a caprolactam (6) / aminoundecanoic acid (11) copolymer with a composition of 55 / 45 and a melting point of 143°C; the melting enthalpy is low, ie 27 J / g, and its molecular weight is 2250 g / mol. After reaction in the extruder, as described in Example 1 (composition consisting of 80 / 20 (by mass) terpolymer / copolyamide), the graft copolymer obtained has the following properties: the morphology Is at the nano and layered or co-continuous level: copolyamide layers (10-20 nm) are connected. Despite mediocre thermomechanical properties, the graft copolymer had a SAFT of 154°C. The product was unable to withstand a stress of 0.05 N / cm at 120 °C, possibly due to low crystallinity. Because of the melting point, the viscosity is low - the product has an MFI of 10 g / 10 min (190°C / 2.16 kg).

Embodiment 3

[0102] The terpolymer used was the same as in Example 1. Copolyamides also use one NH per chain 2 Functionally terminated, but caprolactam (6) / laurolactam (12) copolymer with a composition of 20 / 80 and a melting point of 155° C.; the melting enthalpy is 58 J / g and its molecular weight is 2790 g / mol. After reaction in an extruder as described in Example 1 (composition containing 80 / 20 (by mass) terpolymer / copolyamide), a graft copolymer is obtained with the following properties: the morphology is in the Nano and layered or co-continuous grades: Copolyamide layers (10-20 nm) are linked, leading to excellent thermomechanical properties. The graft copolymers have a SAFT of 145°C, they withstand a stress of 0.05 N / mm for at least 15 minutes and it has an MFI of 20 g / 10min (190°C / 2.16kg).

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Abstract

The present invention relates to a thermal smelting adhesive composition containing components mentioned in the description. Said composition has many virtues: said composition is processed at about 180 DEG C, a general temperature of the thermal smelting adhesive; it is not necessary to wait for a cross-linking after said composition is applied; by utilizing a two-component adhesive such as epoxy resin or other constitution sclerosing agent more simply, said composition exhibits improved remarkably shearing adhesion destruction temperature (SAFT examination), in contrast to a crosslinkable thermal smelting adhesive.

Description

technical field [0001] The present invention relates to hot melt adhesives based on polyamide block graft copolymers. [0002] Hot melt adhesives (adhesives) are thermoplastic materials that are solid at room temperature and which become more or less viscous liquids by heating (around 180°C). These liquids are applied to a first substrate, which is then covered with a second surface. Bonding between the substrate and the second surface is achieved by cooling. The open time (Le temps ouvert) is the period of time during which an adhesive applied to a substrate at room temperature remains tacky, i.e. such a time interval in which it is possible to bond the second surface and by cooling it is possible to achieve a solid surface on the substrate. Adhesion between the material and the second surface. If this open time is exceeded, it is no longer possible to obtain sufficient adhesion between the substrate and the second surface. These adhesives are designated by the abbreviati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G81/02C08L51/06C08L77/00C08L93/00C09J123/00C09J123/02C09J123/26C09J151/06C09J177/00C09J177/10C09J187/00C09J193/00C09J201/00
CPCC08L93/00C08L2205/08C08L51/06C09J187/005C08L77/00C09J193/00C08G81/028C09J151/06C09J123/02C08L51/00C08L2666/02C08L2666/04C08L2666/14C09J177/10
Inventor M·鲍默特F·库尔特C·洛里彻斯
Owner ATOFINA
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