Manufacture of light-conducting board mold

Abstract

The manufacture light-conducting board includes painting photoresist layer onto silicon chip in crystallization orientation 100 as substrate, exposure and development, wet etching to form notch with inclined wall in inclination of 54.74 deg or V-shaped notch of 70.52 deg, removing the photoresist layer, plating conductive metal layer onto the surface, electrotyping to make light-conducting board mold, and final jetting to form light-conducting board product in a jetting molding machine. Compared with traditional manufacture process, the present invention is simple, precise and low in cost.

Description

technical field [0001] The invention relates to a manufacturing method of a light guide plate mold. Background technique [0002] The V-shaped groove on the light guide plate is formed into a non-screen-printed light guide plate, which is used in many advanced optical products, such as digital cameras, liquid crystal display backlights or front light plates for reflective LCDs, especially for LCD backlights It can save cost, because the traditional backlight board needs to add a layer of diffusion sheet and a second layer of concentrating sheet (patented product of 3M company) on the light guide plate, and the concentrating sheet accounts for more than 30% of the cost of the entire backlight module. To reduce the cost, the present inventor has developed a method of direct integral injection molding of many tiny lenses on the light guide plate to replace the traditional light-condensing sheet (such as Taiwan Invention Patent No. 114903 liquid crystal display front light sourc...

AI Technical Summary

Problems solved by technology

[0004] Among them, the ultra-precision machining method is used. Because of the use of machining, the precision of the formed light guide plate and the size of the light spot pattern are limited, and it is impossible to provide a small-volume and uniform-shaped micro-lens mold. Usually, only V-shaped grooves can be processed. (commonly known as Vcut)

[0005] Another photoresist method is used to make the surface of the granular photoresist material on the substrate shrink into a hemispherical shape due to surface tension and shrinkage by heating. Exposure is also easy, but between 50-200μm (the particle size of the microlens used in the backlight is about 20-80μm), the thicker it is, the more difficult it is to do. Therefore, thick film photoresist must be used, and the current exposure equipment needs to expose so deeply. It is a very difficult project and the equipment is extremely expensive (high-energy short-wavelength light such as synchrotron radiation)

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