Circuit board and production method therefor

Abstract

A method of manufacturing a circuit board comprising: an inner layer board laminating step for laminating inner layer board material and one or more metal sheet(s) for inner layer; an inner layer circuit forming step for forming circuits of the metal sheet to make an inner layer circuit board; a multi-layer laminating step for laminating one or more metal sheet(s) for multi-layer, one or more multi-layer board material(s) and one or more inner layer circuit board(s); and a multi-layer circuit forming step for forming circuits of the metal sheet for the multi-layer, wherein the inner layer board material and the multi-layer board material are different in material composition from each other. According to the present invention, it is possible to stabilize the quality of interstitial connection of the inner layer circuit board and to improve the mechanical strength such as the adhesive strength of an outer layer circuit.

Description

technical field [0001] The present invention relates to a circuit substrate that can be used in various electronic devices and its manufacturing method. technical background [0002] In recent years, with the miniaturization and high density of electronic equipment, the circuit boards used to mount electronic components have also progressed from single-sided wiring boards in the past to double-sided wiring boards or multilayer wiring boards, and more High-density circuit boards in which circuits are accumulated on wiring boards are being developed. [0003] Among the high-density circuit substrates, a circuit substrate with an inner via structure has been developed. This circuit substrate with an inner via structure can not only replace the widely used mechanical drilling process formed on the wiring substrate in the past. The through hole (through hole) and the connection between the wiring layers are performed by electroplating, and the connection of the wiring layers arr...

AI Technical Summary

Problems solved by technology

[0029] When the fluidity of the impregnating resin is reduced to prevent the conductive paste 4 from being extruded, the compressibility in the thickness direction of the substrate material 21 during heating and pressing becomes small, and stable electrical connectivity between wiring layers cannot be obtained. question

[0030] Furthermore, when glass fiber is used as a reinforcing material for the substrate material 21, when the via hole 3 is processed by laser processing, the variation in hole diameter is likely to occur, and the electrical connection between the wiring layers becomes unstable.

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