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Warming and cooling semiconductor cup

A semiconductor and water cup technology, applied in the field of semiconductor cold and warm water cups, can solve the problems of affecting product performance, poor sealing performance, poor thermal insulation performance, etc., and achieve the effect of reducing production cost, reducing energy consumption, and simple production process

Inactive Publication Date: 2004-04-07
HISENSE HOME APPLIANCES GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are no special heat insulation measures in the prior art. Traditional insulation cotton is generally used as the heat insulation medium for the heat insulation layer. This heat preservation method has disadvantages such as poor heat preservation performance and poor sealing performance, which directly affects the performance of the product.

Method used

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  • Warming and cooling semiconductor cup
  • Warming and cooling semiconductor cup
  • Warming and cooling semiconductor cup

Examples

Experimental program
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Effect test

Embodiment Construction

[0020] combine figure 1 , figure 2 and Figure 5 , the present invention is a semiconductor cold and warm water cup, which is characterized in that it mainly includes a water cup (1), a base (2), a semiconductor cooler (3), a heat exchanger (4), a radiator (5) and a cooling fan (6 ), the upper part of the base (2) is provided with a cup holder (21), and the semiconductor cooler (3), heat exchanger (4), radiator (5) and cooling fan (6) are installed in the inner cavity of the base (2) Among them, the heat exchanger (4) is located at the bottom of the cup holder (21), the radiator (5) is installed on the heat transfer surface (7) of the semiconductor cooler (3), and the heat exchanger (4) and the base (2 ) and between the heat exchanger (4) and the radiator (5) are provided with a heat insulating chamber (8), and the heat insulating chamber (8) is filled with a foaming material (9). The foaming material of this embodiment (9) It is a rigid polyurethane foam material, and the...

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Abstract

The semiconductor warming and cooling cup is one efficient heat insulating and sealed one in reinforced structure. It consists of cup, base seat, heating and cooling semiconductor device, heat exchanger, heat radiator and heat dissipating fan. The base seat has cup seat in the upper part; the heating and cooling semiconductor device, the heat exchanger, the heat radiator and the heat dissipating fan are installed inside the base seat cavity; the heat exchanger is set in the bottom of the cup seat; the heat radiator is installed in the heat conducting surface of the heating and cooling semiconductor device; and there are heat isolating cavities filled with foamed material set between the heat exchanger and the base seat and between the heat exchanger and the head radiator.

Description

technical field [0001] The invention relates to the field of semiconductor cooling or heating water cups, more specifically a semiconductor cooling and heating water cup. technical background [0002] Semiconductor coolers are often used in small cooling, heating or electrical appliances with both cooling and heating functions due to their simultaneous cooling and heating functions, low power, and low power consumption. At the same time, because the semiconductor cooler plays a role of heating on the one hand and cooling on the other during use, whether it can completely isolate these two aspects during use is whether the effect of the semiconductor cooler can be exerted. key. In the prior art, many adopt the semiconductor cooler technology to make air-flow type hot and cold water cups, as the patent No. is: 5513496 U.S. Patent: BEVERAGE COOLER AND DISPENSER. However, there are no special heat insulation measures in the prior art. Traditional in...

Claims

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Application Information

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IPC IPC(8): A47G19/22A47J31/00
Inventor 陈传瑞肖孟柱卿松林吴清毅胡志勇
Owner HISENSE HOME APPLIANCES GRP CO LTD
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