Making process of electrolytic copper foil with great high-temperature elongation

A technology of electrolytic copper foil and manufacturing method, which is applied in electrolytic process, electroforming, etc., can solve problems such as increased production cost, increased sensitivity to chlorine pollution, troubles in the use of electrolytic copper foil, etc., achieves good surface quality, overcomes thermal cracking or is a distorted effect

Inactive Publication Date: 2004-06-23
IND TECH RES INST
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Problems solved by technology

However, if the concentration of chloride ions is too high, it will increase the surface roughness of the electrolytic copper foil, which will cause problems in the subsequent use of the electrolytic copper foil and increase the production cost; on the contrary, if the concentration of chloride ions is too low, not only the

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  • Making process of electrolytic copper foil with great high-temperature elongation
  • Making process of electrolytic copper foil with great high-temperature elongation
  • Making process of electrolytic copper foil with great high-temperature elongation

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[0024] Considering that the concentration of gelatin in the plating solution required to increase the high temperature elongation of the electrolytic copper foil is relatively low, contrary to the requirement that the concentration of gelatin required to increase the surface quality of the electrolytic copper foil is relatively high, the present invention first changes the concentration of gelatin Control in the range of 0-1.5ppm (lower than the traditional concentration of 2-10ppm). As for the surface quality of the electrolytic copper foil that has been reduced due to this adjustment, the chloride ion concentration should be appropriately and correspondingly adjusted to below 20ppm (6-12ppm is the best), and combined with the acid copper sulfate plating solution under the following conditions It can be manufactured with good surface quality (RzD-3515%, HTE-35μm>20%; HTE: High Temperature Elongation-high temperature elongation) of electrolytic copper foil.

[0025] Formula of aci...

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Abstract

The present invention relates to the making process of electrolytic copper foil with great high-temperature elongation. The electroplating process uses acid copper sulfate electroplating solution containing gelatin not more than 1.5 ppm and chlorine ion not more than 20 ppm, and the electroplating solution makes it possible to raise the high-temperature elongation of the produced electrolytic copper foil and the copper foil is used in making multilayer printed circuit board without hot cracking, bending and distortion produced.

Description

technical field [0001] The invention relates to a method for manufacturing high-temperature elongation electrolytic copper foil, in particular to a method for manufacturing high-temperature elongation electrolytic copper foil suitable for multilayer printed circuit boards. Background technique [0002] Due to the development of electronic products in the direction of multi-function and miniaturization, the single-sided printed circuit boards in the past can no longer bear the increasingly complex circuits, so double-sided printed circuit boards and multi-layer printed circuit boards appear. The specific gravity of the circuit board has also been greatly reduced. In recent years, electronic products have become thinner and smaller, and thin multilayer printed circuit boards with high-density wiring and small holes have also become hot commodities. [0003] In the production process, copper clad substrate (Copper Clad Laminate; CCL) is the main basic component that is indispe...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D3/38
Inventor 陈友忠李鸿坤翁荣洲
Owner IND TECH RES INST
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