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Making process of electrolytic copper foil with great high-temperature elongation

A technology of electrolytic copper foil and manufacturing method, which is applied in electrolytic process, electroforming, etc., can solve problems such as increased production cost, increased sensitivity to chlorine pollution, troubles in the use of electrolytic copper foil, etc., achieves good surface quality, overcomes thermal cracking or is a distorted effect

Inactive Publication Date: 2004-06-23
IND TECH RES INST
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Problems solved by technology

However, if the concentration of chloride ions is too high, it will increase the surface roughness of the electrolytic copper foil, which will cause problems in the subsequent use of the electrolytic copper foil and increase the production cost; on the contrary, if the concentration of chloride ions is too low, not only the process It is not easy to analyze the concentration of the plating solution, and the sensitivity to chlorine pollution from the environment or material sources is greatly increased, which will also make it difficult to control the stability of the process
Therefore, it is not a good way to use low chloride ion concentration

Method used

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  • Making process of electrolytic copper foil with great high-temperature elongation
  • Making process of electrolytic copper foil with great high-temperature elongation
  • Making process of electrolytic copper foil with great high-temperature elongation

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Embodiment Construction

[0024] Because of considering that the concentration of gelatin in the plating solution needed to increase the high-temperature elongation of the electrolytic copper foil is relatively low, contrary to the higher demand for the gelatin concentration required to increase the surface quality of the electrolytic copper foil, the present invention first increases the concentration of gelatin Control in the range of 0-1.5ppm (lower than the traditional concentration of 2-10ppm). As for the surface quality of the electrolytic copper foil that is reduced due to this adjustment, it should be combined with an acidic copper sulfate plating solution with the following conditions to reduce the concentration of chloride ions to below 20ppm (6-12ppm is the best). It can be produced with good surface quality (RzD-3515%, HTE-35μm>20%; HTE: High TemperatureElongation-high temperature elongation) of electrolytic copper foil.

[0025] Acidic copper sulfate plating solution formula:

[0026] Co...

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Abstract

The present invention relates to the making process of electrolytic copper foil with great high-temperature elongation. The electroplating process uses acid copper sulfate electroplating solution containing gelatin not more than 1.5 ppm and chlorine ion not more than 20 ppm, and the electroplating solution makes it possible to raise the high-temperature elongation of the produced electrolytic copper foil and the copper foil is used in making multilayer printed circuit board without hot cracking, bending and distortion produced.

Description

technical field [0001] The invention relates to a method for manufacturing high-temperature elongation electrolytic copper foil, in particular to a method for manufacturing high-temperature elongation electrolytic copper foil suitable for multilayer printed circuit boards. Background technique [0002] Due to the development of electronic products in the direction of multi-function and miniaturization, the single-sided printed circuit boards in the past can no longer bear the increasingly complex circuits, so double-sided printed circuit boards and multi-layer printed circuit boards appear. The specific gravity of the circuit board has also been greatly reduced. In recent years, electronic products have become thinner and smaller, and thin multilayer printed circuit boards with high-density wiring and small holes have also become hot commodities. [0003] In the production process, copper clad substrate (Copper Clad Laminate; CCL) is the main basic component that is indispe...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D3/38
Inventor 陈友忠李鸿坤翁荣洲
Owner IND TECH RES INST
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