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Plate electrode for static electricity sucking disk devices and static electricity sucking disk device using the same

An electrostatic chuck, electrode plate technology, applied in the application of electrostatic attraction holding device, positioning device, circuit and other directions, can solve problems such as inability to apply high voltage, low insulation breakdown voltage, and inability to obtain adsorption force.

Active Publication Date: 2004-09-01
TOMOEGAWA PAPER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the low dielectric breakdown voltage of ceramics such as alumina and insulating adhesive used in conventional electrostatic chuck devices, high voltage cannot be applied, and there is a problem that sufficient adsorption force cannot be obtained.

Method used

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  • Plate electrode for static electricity sucking disk devices and static electricity sucking disk device using the same
  • Plate electrode for static electricity sucking disk devices and static electricity sucking disk device using the same
  • Plate electrode for static electricity sucking disk devices and static electricity sucking disk device using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] By doing the following, make Figure 4 The electrostatic chuck device with the structure shown is an electrode plate and an electrostatic chuck device.

[0079]As the insulating organic film on the upper side, a polyimide film (trade name Capton manufactured by Toray Dupont Co., Ltd.) with a film thickness of 75 μm was prepared, and it was formed on one side in the same manner as in the insulation resistance test of the insulating adhesive. electrodes and terminals. Next, the insulating adhesive 1 obtained above was coated on the electrode forming surface so that the thickness after drying was 15 μm, and then semi-cured by drying and heating to form an insulating adhesive layer. The insulating organic film on the lower side was bonded with a polyimide film (trade name Capton manufactured by Toray Dupont) having a film thickness of 50 μm. Next, the insulating adhesive layer is completely cured by heating to obtain the electrode plate for an electrostatic chuck device o...

Embodiment 2

[0083] By doing the following, make figure 2 The electrostatic chuck device with the structure shown is an electrode plate and an electrostatic chuck device.

[0084] As the insulating organic film on the lower side, a polyimide film (Ube Industries, Ltd. product name Upilex) with a film thickness of 50 μm was prepared, and the insulation resistance test of the insulating adhesive was carried out on one side in the same manner. form electrodes and terminals. Next, the insulating adhesive 2 obtained above was applied on the electrode forming surface so that the thickness after drying was 20 μm, and then semi-cured by drying and heating to form an insulating adhesive layer. As the insulating organic film on the upper side, a polyethylene terephthalate film (manufactured by Teijin DuPont Film Co., Ltd.) with a film thickness of 50 μm was bonded. Next, the insulating adhesive layer is completely cured by heating to obtain the electrode plate for an electrostatic chuck device of...

Embodiment 3

[0088] By doing the following, make figure 2 The electrostatic chuck device with the structure shown is an electrode plate and an electrostatic chuck device.

[0089] As the insulating organic film on the lower side, a polyethylene terephthalate film (manufactured by Unichika Co., Ltd.) with a film thickness of 50 μm was prepared, and electrodes and terminals were formed on one surface thereof. Electrodes were formed in the same manner as in the insulation resistance test of the insulating adhesive, except that nickel with a thickness of 500 Å was subjected to aluminum plating. Next, the above-obtained insulating adhesive 1 was coated on the electrode forming surface so that the thickness after drying was 20 μm, and then semi-cured by drying and heating to form an insulating adhesive layer. The insulating organic film on the side was a polyethylene terephthalate film (manufactured by Unichika Co., Ltd.) with a film thickness of 50 μm. Next, the insulating adhesive layer is ...

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Abstract

The object of the present invention is to provide an electrode sheet for electrostatic chuck devices which has sufficient adsorption power to insulating materials. In order to achieve the object, the present invention provides an electrode sheet for electrostatic chuck devices (30) comprising a pair of insulating organic films (31) and (32), which are adhered by an insulating adhesive layer (33), and electrodes (34) and (35), which are present in the insulating adhesive layer (33), wherein the thickness of the insulating adhesive layer (33) is larger than that of the electrodes (34) and (35).

Description

technical field [0001] The present invention relates to an electrode plate for an electrostatic chuck device that can be well adsorbed and held not only conductors or semiconductors such as wafers of semiconductor devices but also insulators such as glass substrates of liquid crystal devices, and an electrostatic chuck device using the same. Background technique [0002] In the manufacture of semiconductor devices, a chuck device for suction-holding a wafer is used in order to fix the wafer to a predetermined position of a processing device such as a plasma etching device. As the chucking device, there are mechanical, vacuum, electrostatic, etc. Among them, the electrostatic chucking device is easy to use and has an advantage that it can be used even in a vacuum. Conventional electrostatic chuck devices are disclosed, for example, in Patent Documents 1 to 5. It is known that a pair of ceramic substrates are used to sandwich electrodes, or that a pair of insulating organic fi...

Claims

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Application Information

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IPC IPC(8): H01L21/683B23Q3/154H01L21/68H02N13/00
CPCF17C13/12F17C2260/042
Inventor 岛武志栃平顺长谷川雄一山本敏之堀真寿今西章夫
Owner TOMOEGAWA PAPER CO LTD
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