Cooling system for electronic apparatus

Abstract

An electronic equipment or apparatus, small-sized and thinned in the thickness thereof, having a system for cooling an semiconductor element generating high temperature, comprising: a case mounting the semiconductor element within an inside thereof; a heat-receiving member being thermally connected with the semiconductor element; a heat-radiation member being disposed on an interior surface side of the case; a liquid driving means for driving a liquid coolant between the heat-radiation member and the heat-receiving member; a tank for accumulating the liquid coolant therein; and tubes for connecting between the tank, the heat-radiation member, and the heat-receiving member, wherein the tube is made of either one of butyl rubber, nitrobutadien rubber, fluororubber, ethylene-propylene rubber, hydrinrubber, or polysulfide rubber, so that a permeation amount 'q' of the coolant is determined to be equal to or less than a containing amount 'Q' of the coolant. Also, a protection tape or a protection tube is attached on a curved portion of the tube, for use of protection from abrasion and buckling, and the tube is formed, by winding itself in advance, fitting to a shape of a curved portion thereof.

Description

[0001] This application is a divisional application of the application No. 02800141.9 filed by Hitachi, Ltd. on July 10, 2002. technical field [0002] The present invention relates to an electronic device and a cooling system for electronic equipment which cool a heat-generating semiconductor element by circulating liquid. Background technique [0003] As conventional devices for cooling semiconductor elements in electronic equipment or devices, in addition to devices using natural convection and devices using forced air cooling by fans, devices using heat pipes and devices using water cooling are known. [0004] Conventional electronic equipment or devices having such heat pipes are disclosed in, for example, Japanese Patent Application Laid-Open Nos. 1-84699 and 2-244748. [0005] Cooling using the water cooling device having the heat pipe is efficient because it does not use power-consuming components such as an air blower, and cooling by heat conduction can be enhanced ...

AI Technical Summary

Problems solved by technology

[0012] However, the flexible pipe has the problem that the moisture inside the pipe permeates the surface of the pipe. However, in the above-mentioned prior art, no consideration has been given to the material impermeable to moisture.

[0013] That is, when using a flexible tube with a high moisture permeability, the amount of retained moisture decreases, and there is a problem that cooling of the heating element cannot be performed.

[0014] In addition, in the hinge portion of the main body side case and the display side case that can be moved in a rotatable manner, the load generated by the repeated opening and closing of the display device case is added to wear the flexible pipe, and water is generated from the worn part. the problem of leakage

[0015] In addition, in the box, when the flexible tube is rotated with a small curvature radius and is held in its shape for a long period of time, the flexible tube bends and blocks the flow path, resulting in a decrease in the flow rate that prevents heating of the heating element. cool down

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